Carlsbad, CA – May 1, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at SMT Nuremberg 2012, May 8-10, with live wire bonder demonstrations.
Palomar Technologies will exhibit in Hall 6 Booth #433 and will showcase an 8000 Wire Bonder and a Royce 650 Universal Bond Tester.
The 8000 Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.
Palomar Technologies offers several complementing die bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the ultra flexible 3800 Die Bonder, which supports up to three channels of adhesive dispense, component placement, epoxy and eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.
Mr. Josef Schmidl, director of Palomar Technologies Europe located in Erlangen, Germany, will be attending SMT Nuremberg and is available during the conference for any on-site meetings.
Mr. Dale Perry, Regional Manager of the Eastern North/South Americas, will also attend SMT Nuremberg. Mr. Perry is available during the duration of the conference to discuss Palomar Technologies Assembly ServicesTM capabilities and solutions.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
###
Carlsbad, CA – April 10, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced its collaboration with VubIQ, Inc., to enable the new HD video capturing system for the National Hockey League (NHL) in-goal cameras.
After completing a rigorous series of prototype testing and field trials with Palomar Technologies Assembly ServicesTM (“Assembly Services”), VubIQ was given an order to equip all 30 NHL venues throughout the U.S. and Canada with GoalCam systems. Each system is comprised of two units: a GoalCam unit (HD camera and 60 GHz transmitter) and a 60 GHz receiver unit. Additionally, each unit is designed to incorporate future Wi-Fi upgrades, allowing for remote wireless adjustment of seven different functions: camera pan, camera tilt, RF antenna pan, RF antenna tilt, HD camera focus, HD camera iris, and HD camera zoom.
“Historically, the NHL had difficulties verifying whether or not a “close call” was an actual goal, and lacked a consistent or reliable vetting method. VubIQ received an order to provide systems to the NHL for highly reliable goal adjudication,” stated Adam Button, CEO of VubIQ. “With cameras far overhead positioned in various angles around the rink, the puck could not be video recorded at a close distance or in high resolution as it crossed (or did not cross) the goal line. Until now, goal judges positioned behind each goal during games typically made the call by switching on a red flashing light; but these judges did not have the luxury of instant replay or precise slow motion (forward or reverse) to assist with close calls. Now, however, with our GoalCams positioned inside the goal itself, and transmitting the uncompressed HD video wirelessly to the judging booth, it is as though the goal judges are literally right on top of the action—only with the additional benefit of slow-motion, back-and-forth replay in full HD.”
Since a cabled solution to this problem would not be feasible, an extremely high bandwidth wireless system was required. Marketing the GoalCam technology though its OEM distributor, VidOvation, Vubiq provides the NHL with an elegant wireless solution utilizing the unlicensed 60 GHz spectrum that addresses two key issues—achieving the highest possible video quality and eliminating transmission interference.
Assembly Services supported VubIQ through the development and optimization of precision die attach processes and the parameters for all wire interconnecting and encapsulation processes to assemble the components for the GoalCam transmitters (TX) and receivers (RX). Assembly Services also managed the substrate attach process and final documentation of all final module packaging processes where the completed sub-assembly is mounted onto aligning hardware.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
About VubIQ
VubIQ, headquartered in Aliso Viejo, California, is a millimeter wave technology company specializing in the development of components and final products utilizing 60 GHz silicon transmitters and receivers. While there is a strong worldwide effort to develop the silicon by major fabrication houses, no other company has achieved the capability of effectively packaging that silicon into efficient, low cost, and highly manufacturable products. VubIQ has five issued patents and six others in process. The technology underlying all of VubIQ’s current and future product offerings utilizes millimeter wave radio frequencies to transmit and receive signals and data at extremely high data rates, in a very small form factor, and at low cost.
###
Carlsbad, CA – March 13, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit with Asia Science and Technology (AST) at SEMICON China 2012, held in Shanghai on March 20-22.
Palomar Technologies, Hybond and AST will exhibit together in booth #3153 in Hall E3. A Palomar 3800 Die Bonder and manual Hybond equipment will be on-site for demonstrations.
Mr. PH Chan, Palomar Technologies Asia Director, recently wrote a blog summarizing the LED markets in Asia, specifically recounting how LEDs relate to China’s 12th five-year plan.
“By 2015, China intends its manufacturing standards to be globally viable for the volume production market. By that time, China’s LED industry is estimated to reach $75 billion,” stated Mr. Chan. “The 3800 Die Bonder is capable of ultra-high precision and high-reliability eutectic and epoxy die attach processes. This robust system is in production with several major players in the Asia-based LED market today. The 3800 Die Bonder embodies great versatility to accommodate multiple processes on a single 710in2 work envelope as well as tremendous flexibility to remain vigilant for the future of component packaging.”
Mr. Chan will be attending SEMICON China and is available during the conference for any on-site meetings.
In addition to the ultra-flexible 3800 Die Bonder, Palomar Technologies offers several complementing bonder systems: the 6500 Die Bonder is an ultra-high placement accuracy pick-and-place machine, which also has a wafer level packaging (WLP) configuration; and the 8000 Wire Bonder is a large area, high-reliability wire bonder and ball bumper with deep access capabilities. Augmenting the bonder systems are Palomar Technologies Customer Services (Field Service support, Process Development Consulting and bonder training courses) and Palomar Technologies Assembly ServicesTM, which offer customers the unique ability to prototype and develop critical processes and materials with an OEM.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
###
Carlsbad, CA – February 1, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced a precision eutectic process development for direct attach light emitting diodes (LEDs).
“Direct-attach LEDs are the next generation of solid-state LED emitters that deliver superior value for consumer products and markets that include TV backlighting, camera flash and a variety of general illumination needs,” explains Donald Beck, General Manager of Palomar Technologies Assembly ServicesTM. “Assembly Services is supporting more than 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier. Palomar Technologies’ Pulsed Heat System is a major contributor to this development, allowing our precision die attach systems to control LED exposure much more effectively than most other processes. The bondpad-down design of direct-attach LEDs eliminates the need for wire bonds, yet improves the thermal management.”
Palomar Technologies is exhibiting at the LED-focused show, Strategies in Light 2012, in booth #709 on February 7-9 in Santa Clara, CA. Julie Adams, Director of WW Assembly Services Sales will be on site to assist in discussions about Palomar Technologies’ current LED packaging capabilities, including direct-attach LED eutectic bonding.
Also on February 7-9, Palomar Technologies is exhibiting as a premier sponsor at IMAPS RF 2012 in booth #RF01, held in San Diego, CA. Bradley Benton, Western Americas Sales Manager, will be presenting an overview of Palomar Technologies’ solutions and advanced RF automated packaging processes on February 8 at 1:00pm, local conference time.
Contact Palomar Technologies to arrange an on-site meeting at either Strategies in Light 2012 or IMAPS RF 2012.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
###
Carlsbad, CA – January 4, 2012 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it has sustained revenue growth and profitability for a fifth consecutive year.
“The hard work and dedication of Palomar’s worldwide team and the loyal support of our customers has resulted in our fifth consecutive year of positive growth in revenue and profitability,” stated Bruce W. Hueners, president and CEO of Palomar Technologies. “We have continued to meet our customers’ complex packaging needs by providing high-precision wire bonding and die attach solutions and significantly increasing our bandwidth to address new opportunities. Our performance in 2011 has provided a solid foundation for continued expansion of the company to better serve our customers.”
In addition to fully automated wire bonders and die attach systems, Palomar Technologies offers prototyping, test and contract assembly packaging solutions through Palomar Technologies Assembly ServicesTM. Palomar Technologies Customer Services provides services such as bonder training and on-site support from Field Service Engineers and Process Development Consultants to ensure customers are achieving maximum performance on their systems.
Palomar Technologies was recognized for seven awards in 2011, including the New Product Introduction Award for the 3800 Die Bonder—the ultra flexible, high accuracy die attach machine launched in 2010—and the 2011 IMAPS Corporate Recognition Award.
Palomar Technologies continues its strong alliance channels with Hybond (manual bonder systems), GPD Global (precision fluid dispensing systems) and Royce Instruments (pull/shear testing equipment) to further support the complex microelectronic packaging needs among its large worldwide installed base.
Palomar Technologies is headquartered in Carlsbad, CA, with offices in Germany and Singapore, employing a highly specialized staff of service technicians located around the world. For more information on current open positions, please email resumes@bonders.com.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
###
Carlsbad, CA – 8 November 2011 – Palomar Technologies gibt heute ihre Teilnahme an der Productronica in München vom 15.-18.November 2011 bekannt.
Sie finden den weltweit führenden Hersteller für vollautomatische und hochpräzise Fertigungsanlagen (Wire- und Diebonder) in Halle B2, Stand 315.
Die Anlagen von Palomar kommen für die verschiedensten Anwendungen in der Hybrid- und Halbleiterindustrie zum Einsatz.
“Palomar Technologies hat eine jahrzehntelange Erfahrung und anerkannte Fachkompetenz in den Bereichen Entwicklung, Konstruktion, Automatisierung und Meßtechnik auch für schwierigste Applikationen in der Wire- und Bestückungstechnologie“, sagte Josef Schmidl, Geschäftsführer der Palomar Technologies GmbH. “Unsere Modelle 8000 Wire Bonder sowie 3800 Die Bonder repräsentieren heute den neuesten Stand in der Wire-/ Diebond Technik. Zu den einzigartigen Maschinenkonzepten mit seinen hervorragenden Meß- u. Regelsystem, ermöglichen benutzerfreundliche Softwarelösungen eine einfache Bedienung und sind auch in Bezug auf Durchsatz und Flexibilität konkurrenzlos.”
Das Modell 8000 Wire Bonder, bietet enorme Einsatzflexibilität wie z.B. Deep Access bis zu 19.05mm Bondtiefe, Verwendung von In-Line Magazinsystemen, Erzeugung absolut flacher Stud Bumps (kein Tail), Stand-off-Stitch wires (Plazierung eines Bumps vor dem Draht) und vieles mehr. Bei einer Bondgeschwindigkeit von bis zu 0.125s/ Draht (0.077s/ Bump) und einer Gesamtgenauigkeit von ±2.5µ, 3Sigma, erzielt der 8000 Ballbonder höchste Erträge und wird daher für die Verarbeitung hochkomplexer Hybride, MCM’s usw. eingestzt.
Das Model 3800 Die Bonder ist ein vollautomatisches, extrem flexibles Pick and Place System mit einer Plaziergenauigkeit von ±7µ und einer Wiederholgenauigkeit von 3.5µ, bei 3sigma.
Der Diebonder wurde kürzlich mit dem 2011 New Product Introduction Award für seine Leistungsfähigkeit und Einsatzflexibilität ausgezeichnet, da mit ihm auch Prozesse wie eutektisches AuSi/ AuSn Löten durchgeführt werden können.
Zurzeit läuft eine Umtausch-/ Rücknahme Aktion des bewährten Vorgängermodells 3500-III gegen den Kauf eines neuen Modells 3800 (Palomar Technologies’ Bonder Buy-Back Program).
Palomar Technologies
Palomar Technologies, ein früheres Tochterunternehmen von Hughes Aircraft, ist der weltweit führende Hersteller von vollautomatischen, hochpräzisen Large Area Die- u. Wirebonder sowie Anbieter von Dienstleistungen (Produkt-/ Prozessentwicklung, Fertigung) in diesen Bereichen.
Kunden setzen die Systeme und Dienstleistungen von Palomar Technologies ein um den heutigen komplexen Anforderungen in der Mikroelektronikfertigung gerecht zu werden.
Weitere Informationen finden Sie bitte auf der Website www.palomartechnologies.com.
###
Kontakt Palomar Technologies GmbH (Europe)
Josef Schmidl
Managing Director, Palomar Technologies GmbH
jschmidl@palomartechnologies.de | 49-9131-48009-30
----
Carlsbad, CA – November 8, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit in Hall B2, Booth 315 at Productronica 2011, held in Munich, Germany on November 15-18.
“Palomar Technologies has a long-standing presence as an industry expert in design, engineering, automation and metrology for even the most complex component placement and wire bonding applications,” said Josef Schmidl, managing director of Palomar Technologies GmbH. “Our 8000 Wire Bonder and 3800 Die Bonder represent the latest advances in wire- and die bonding technology, incorporating leading-edge mechanical design, control architecture and user-friendly GUI to provide the highest net throughput and flexibility of any comparable tool on the market today.”
The 8000 Wire Bonder offers tremendous versatility with capabilities including deep access wire bonding of 11.10 to 19.05mm, automated in-line and magazine handlers, tailless bump mode and improved reliability with stand-off stitch wires. With cycle times up to 0.125 sec/wire and 0.077 sec/bump, and a placement accuracy of +/- 2.5 micron, 3 sigma, the overall precision of the 8000 Wire Bonder results in high-yield processing of fine-pitch high wire count applications and is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.
The 3800 Die Bonder—the fully automated and ultra-flexible component placement system capable of a placement accuracy of +/- 7 microns and repeatability of 3.5 micron at 3 sigma—was recently awarded the 2011 New Product Introduction Award for its efficiency and versatility to perform such processes as AuSi/AuSn eutectic attach. Current owners of 3500-III Die Bonders have the opportunity to trade in their system for substantial credit towards the 3800 Die Bonder through Palomar Technologies’ Bonder Buy-Back Program.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
###
Awards Event to Showcase San Diego’s Finest Technology Companies
Carlsbad, CA – October 20, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it has been selected as a finalist in the Semiconductors category for the upcoming 18th Annual TechAmerica High Tech Awards. As the leading voice representing the U.S. technology industry, TechAmerica takes pride in recognizing outstanding regional companies every year at its annual awards ceremony. Finalists will be acknowledged for their achievements during a luncheon reception on October 28th at the Hilton La Jolla Torrey Pines in La Jolla, CA.
“Palomar Technologies specializes in automated high-precision die attach and wire bonding systems for microelectronic production. Our team of experts is constantly pushing the envelope to help our customers create that ‘next big thing’,” stated Bruce Hueners, president and CEO of Palomar Technologies. “Our fellow 2011 TechAmerica finalists are a remarkable group of San Diego’s semiconductor organizations, and Palomar is proud to be recognized among them.”
Palomar Technologies was selected as a finalist in the Semiconductor category for its high-accuracy wire and die attach services via fully automated component packaging systems and precision contract assembly, process development, test and prototyping divisions.
This year, several San Diego-based companies were nominated for their technological or business innovation; exceptional products or service; product marketplace validation; perseverance in the face of adversity; and community involvement for consideration in nine categories.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
About TechAmerica
TechAmerica is the driving force behind productivity growth and jobs creation in the United States and the foundation of the global innovation economy. Representing approximately 1,500 member companies of all sizes from the public and commercial sectors of the economy, it is the industry’s largest advocacy organization and is dedicated to helping members’ top and bottom lines. It is also the technology industry's only grassroots-to-global advocacy network, with offices in state capitals around the United States, Washington, D.C., Europe (Brussels) and Asia (Beijing). TechAmerica was formed by the merger of AeA (formerly the American Electronics Association), the Cyber Security Industry Alliance (CSIA), the Information Technology Association of America (ITAA) and the Government Electronics & Information Technology Association (GEIA). Learn more at www.aeanet.org or www.itaa.org.
###
Carlsbad, CA – October 4, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at IMAPS 2011 in Long Beach, California on October 11-13, in booth #231.
Palomar Technologies is presenting two HB LED technical papers in the Advanced Technologies Track at IMAPS 2011. Palomar Assembly ServicesTM general manager, Donald Beck, has co-authored “High-Yield Process Improvements for High-Reliability HB-LED Automated Assembly” and “Evaluation of AuSn Eutectic Die Attach Materials Designed for High-Brightness LED Packaging.” Beck will be on-site at IMAPS to discuss recent advancements in the LED industry.
“Today’s HB LED applications require maximum thermal transfer to achieve performance results. Precision eutectic soldering provides high-quality, low-risk performance,” stated Beck. “Reaching performance and cost targets requires continuous improvements in LED devices and packaging designs. Close LED proximity is one of several paths that help to extract every possible lumen per watt. This is best achieved using a pulsed heat eutectic die attach and chain wire bonding.”
Palomar Technologies offers a Pulsed Heat System (PHS), designed especially for the ultra-flexible 3800 Die Bonder. The PHS allows for a tightly controlled reflow, resulting in a stronger eutectic die bond without voiding. Computer-controlled software provides a highly regulated temperature profile and data feedback throughout the process.
Chain bonding has become a reliable and cost-effective alternative to wedge bonding. Using ball bond technology on the high-reliability 8000 Wire Bonder, chain bonding follows a ball-loop-stitch-loop-stitch process, producing “chains” of loop shapes traditionally generated by a wedge bonder. Wedge emulation with a ball bonder using chain bonding can be an excellent alternative to using a wedge bonder to perform interconnects. To learn more, download "The Great Debate: Ball vs. Wedge" technical paper.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
###
Carlsbad, CA – August 31, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at SEMICON Taiwan 2011 in Taipei from September 7-9 in booth #1006.
The Palomar Technologies Asia-Pacific team has joined forces with Supremetec Materials, Inc. to offer the latest in high-accuracy die bonders and wire bonder systems at this year’s tradeshow. Mr. PH Chan, Palomar Technologies’ Asia-Pacific Director, will be on-site to discuss the latest advancements in systems and process development from Palomar Technologies.
“In order to ensure a seamless transfer of equipment, the Palomar Technologies Asian field services team works closely with customers to cover proper planning, coordination and scheduling. Our customers experience a ‘plug and play’ when the die bonders arrive at their Asian facilities,” states Chan. “Most of our Asian customers who previously deployed 3500 Die Bonders have now entered the second phase of their expansion in production capacity by purchasing new equipment. We have seen an increase in customers’ decision to switch over to the ultra-flexible 3800 Die Bonder to meet new and more challenging packages, such as those requiring 5-7um placement accuracy at 3-sigma.”
Palomar Technologies combines more than 30 years of process know-how with a high-precision line of machines to ensure their bonders maintain production at peak performance. The 2100C Laser Interferometer provides a non-contact method to check the performance of a wire bonder’s ultrasonic system through laser interferometer technology. Without calibration, a wire bonder will suffer process inconsistencies. The 2100C makes this calibration an efficient and user-friendly action.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
###
Carlsbad, CA,2011/9/1, Palomar是世界頂尖微機電與光電封裝系統的服務提供者，今日宣布將參加2011台灣半導體展，從9/7到9/9，攤位號碼1006。
Palomar亞洲區營運總部與台灣Supremetec Materials, Inc今年一起在台灣介紹最新高精密度黏晶機與打線機。Palomar亞洲總监-PH Chan將會於現場就Palomar機器討論最新進展與產品開發流程。
PH說 “為了確保儀器運轉順利，Palomar亞洲營運總部與客戶之間緊密的配合與合作。當黏晶機設備抵達亞洲時，我們的客戶體驗到了所謂的隨插即用的簡單方便性。大多數於亞洲擁有機型3500 黏晶機的客戶，目前都進入了下個擴展階段要購買新儀器。我們發現增加了很多客戶要決定換購多功能的超高弾性機型3800的黏晶機，以便符合產品的多元性封裝挑戰，像是具備在3-sigma下達到5~7 um的放置精確度。”
Palomar Technologies 以30年的工艺經驗配合了各種高精密度設備，使公司所提供的黏晶機與打線機運作的更加完美。2100C Laser Interferometer雷射機透過雷射技術提供非接觸性技術來檢測打線機的超音波系統性能，該方法藉計算干擾邊線方式精確量測過實際超音波軌跡。 未經過校正的打線機會面臨一連串的不協調問題。2100C會讓這校正更有效率與操作上容易使用。
關於Palomar Technologies
Palomar Technologies 前身是休斯航太，是世界上頂尖提供自動化高精密度，大工作區域黏晶機與打線機的服務廠商。顧客使用Palomar的機器，服務與方法來達成對光電產品的封裝，多種類的組裝與微機電種類的貼合。相關更多資訊請參閱www.palomartechnologies.com
Carlsbad, CA – August 16, 2011 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that the company has recently been officially registered with the U.S. Department of State pursuant to the International Traffic in Arms Regulations (ITAR).
“Palomar Technologies is fully ITAR compliant. We are able to manufacture and manage sensitive ITAR projects for our customers. Our technologies, training and processes are constantly reviewed and updated to ensure they meet and exceed ITAR and Government regulations,” states Bruce Hueners, president and CEO of Palomar Technologies. “Our ITAR registration and ISO certification are symbols of how Palomar is committed to quality, conformance and customer satisfaction in the most demanding applications.”
Any person or company who engages in the U.S. in the business of either manufacturing or exporting defense articles or furnishing defense services is required to register. Palomar Technologies and Palomar Assembly Services™ (“Assembly Services”) are committed to meet the unique needs of customers requiring ITAR-compliant processes, manufacturing and material provisions.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
###
