Palomar Technologies to Exhibit at SEMICON China in Shanghai

Posted by Janine Powell on Thu, Mar 09, 2017

Carlsbad, CA—March 8, 2017—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be exhibiting at SEMICON China at the Shanghai New International Expo Centre in Shanghai on March 14-16 in booth #4543. Be First Technology Co. Ltd will be representing Palomar at the show, alongside some key members of the Palomar and SST Vacuum Reflow Systems teams. The 3880 Die Bonder, as well as the SST 5100 Vacuum Pressure Furnace will be showcased at the booth; SST will also be launching a new product at the show.

Talk With Palomar About Die Bonding
The 3880 Die Bonder is the next-generation die bonder with an improved bondhead design, integrated with a Z-Theta leveling mechanism and high speed bi-directional 8-tool turret. Because of the 3880’s inherent highly repeatable planarity feature, wide force range, and fast tool change, customers in the optoelectronic and RF/wireless device packaging markets have seen the greatest increases in performance and throughput.

Palomar shoot 1 3880 wTech.png
SST Vacuum Reflow Systems
Exhibiting with Palomar at SEMICON China will be SST Vacuum Reflow Systems. Palomar acquired SST in March of 2015, and have been actively integrating the SST solutions within Palomar’s suite of advanced packaging and assembly products. A critical feature of SST’s unique position is its expertise in designing and 5100.pngmachining graphite tooling plus process expertise. With refined process expertise, SST provides a void-free eutectic attach, hermetic package sealing, glass to metal sealing, and wafer level bonding. The Model 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. Be sure to stop by the booth to see this system live, along with their newest product addition.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About SST Vacuum Reflow Systems
SST Vacuum Reflow Systems is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment. For more information, visit www.sstinternational.com.

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APAC Contact
Mr. PH Chan
Director of North Asia Sales
Palomar Technologies (S.E. Asia) Pte Ltd | (+65) 6686-3096

Media Contact
Katie Schirmer
Marketing Communications Manager
Palomar Technologies, Inc.
kschirmer@bonders.com | +1 760.931.3680

Tags: Announcements, trade shows, SEMICON China, SST Vacuum Reflow Systems

Palomar Technologies to Present and Exhibit at IMAPS 2016

Posted by Katie Finney on Tue, Oct 04, 2016

Carlsbad, CA – October 4, 2016 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be presenting a technical paper and exhibiting at the IMAPS 49th International Symposium on Microelectronics in Pasadena, CA being held on October 10-13, 2016 in booth #702.

Palomar Technologies’ Chief Technical Officer, Dan Evans, will present the paper “Wedge Bonding Wire and Ribbon to Support RF and Optoelectronic Packaging” on Thursday, October 13th at 10:30am. This paper will provide a survey of RF and optoelectronic packages, and the common wire and ribbon bond requirements. It will also survey the packaging challenges and solutions available to process engineers. Collaborations between manufacturer and equipment supplier with helpful tips leveraging each other’s strengths to transition from concept to production will also be discussed.

In addition, SST Vacuum Reflow Systems, as part of Palomar Technologies total solutions for eutectic die bonding and advanced packaging systems, will present their technical paper “Achieving Low Voiding with Lead Free Solder Paste for Power Devices”, and will be performing live demos of their 5100 Vacuum Pressure Furnace. SST’s Process Development Engineer, Pierino Zappella, will present this paper on Thursday, October 13th at 1:00pm. The processes discussed in this session will show how low void levels can be achieved while using solder paste on different materials in a vacuum reflow oven.

Don’t forget to also stop by booth 702 during the Palomar Technologies sponsored Dessert Happy Hour and during the exhibition to learn more about Palomar Technologies and SST Vacuum Reflow Systems.

IMAPS_Pasadena_2016.jpg

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Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

Tags: Announcements, trade shows, IMAPS, IMAPS 2016

Wedge and Die Bond Demos at SEMICON West 2016

Posted by Janine Powell on Wed, Jul 06, 2016

Carlsbad, CA – July 6, 2016 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced product demos at SEMICON West 2016. The 9000 Wedge Bonder, 3880 Die Bonder, and SST 5100 with QuikCool™ system will be showcased through live demonstrations in booth #5952 on July 12-14 at the Moscone Center in San Francisco, CA.

Test Drive the New 3880 Die Bonder at SEMICON West 2016
Palomar Technologies' new 3880 Die Bonder features a fully integrated Z-Theta bidirectional bond head enabling reduced maintenance and uniformity across a wide range of applications. The new machine’s combined fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Presentation options include wafer, waffle/gel pak, tape and reel, boat, and carriers. Custom stages are also available.

Palomar_shoot_1_Tool_Arm_detail.png

In the early 1990s, Palomar developed the “tool turret” design which has become standard on all of our die bonders. This tool turret is outfitted with 8 tools and designed for customers who require maximum flexibility while maintaining throughput and yield. We designed the 3880 Die Bonder by keeping the tool turret idea and maintaining 8 tools. Several new features were added to improve capabilityspeedservice reliabilityease of operation, and cost-of-ownership.

Automated High-Speed Fine Wire Wedge & Ribbon Bonder Demos
Along with the 3880 Die Bonder, attendees at the show will be able to view a full application demo of the 9000 Wedge Bonder with inline handlers using i2Gi®: Intelligent Interactive Graphical Interface®.  The 9000 Wedge Bonder offers ultimate control and flexibility to change from a 45-60° wire feed range to 90° deep access with only a clamp change on the robust, theta-rotation bond head.

9000_wHandlers.png

SST Vacuum Reflow Systems Announce New QuikCool Auxiliary Cooling System
Also on exhibit in the Palomar Technologies booth will be SST’s new auxiliary cooling system option for their Model 5100 Vacuum Pressure Furnace. The New_QK_B.pngQuikCool system was a response to customers who wanted to know how they could increase batch production throughput, thus reducing costs and increasing the volume of units produced. By quickly reducing the chamber’s temperature after reflow, process cycle time is reduced, thus allowing more production cycles per hour.

Be sure to stop by the booth if you are visiting SEMICON West, check out a demo, and speak with our experts about your application challenges.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

Tags: Announcements, trade shows, SST Vacuum Reflow Systems, SEMICON West 2016

Palomar Technologies to Exhibit at SEMICON Southeast Asia and SMT Nuremberg

Posted by Rich Hueners on Tue, Apr 19, 2016

Carlsbad, CA—April 19, 2016—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be exhibiting at SEMICON Southeast Asia at the SPICE Arena in Penang, Malaysia on April 26-28 in booth #209. They will also be exhibiting at SMT Hybrid Packaging in Nuremberg, Germany on April 26-28 in booth 7A-205.

Palomar made several noteworthy announcements in 2015, including the launch of its new 3880 ultra-flexible die bonder and its acquisition of SST International.

Talk With Palomar About Die and Wedge Bonding
The 3880 Die Bonder is the next-generation die bonder with an improved bond 3880_bondhead.pnghead design, integrated with a Z-Theta leveling mechanism and high speed bi-directional 8-tool turret. Because of the 3880’s inherent highly repeatable planarity feature, wide force range, and fast tool change, customers in the optoelectronic and RF/wireless device packaging markets have seen the greatest increases in performance and throughput. Also new to the Palomar suite of solutions is the 9000 Fine Wire Wedge Bonder. Devised and designed for modern wedge bonding, the 9000 uses a voice coil driven bond head with interchangeable clamps for 45-60° and 90° feed angles. Customers doing ribbon bonding benefit from being able to use the same clamp with ribbon as they do with round wire. Because the bond head itself turns on a single mechanism, there is no twisting of ribbon or wire during the bonding process. The feed path is shorter, the control better, and the precision of wedge bonding greatly improved.    

SST Vacuum Reflow Systems
Exhibiting with Palomar at SEMICON Southeast Asia will be SST Vacuum Reflow Systems. Palomar acquired SST in March of 2015, and have been actively integrating the SST solutions within Palomar’s suite of advanced packaging and SST-graphite_tooling.jpgassembly products. A critical feature of SST’s unique position is its expertise in designing and machining graphite tooling plus process expertise. With refined process expertise, SST provides a void-free eutectic attach, hermetic package sealing, glass to metal sealing, and wafer level bonding.

Palomar Technologies GmbH will also be exhibiting at SMT Hybrid Packaging next week in Nuremberg, Germany. The 9000 Wedge Bonder will be on display, as well as SST's 5100 Vacuum Pressure Furnace. They would love to speak with you at the show about packaging challenges and possible solutions.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

About SST International
SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment. For more information, visit www.sstinternational.com.

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APAC Contact
Mr. PH Chan
General Manager, Asia Pacific
Palomar Technologies (S.E. Asia) Pte Ltd | (+65) 6686-3096

EMEA Contact
Mr. Josef Schmidl
Managing Director, Europe
Palomar Technologies GmbH | 49 (9131) 48009-30

Media Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760.931.3680

Tags: Announcements, trade shows, SEMICON Southeast Asia, SMT Nuremberg

Palomar Technologies' 3880 Die Bonder Wins the NPI Award for Bonders

Posted by Katie Finney on Tue, Mar 29, 2016

Circuit Assembly announced on March 15, 2016 that Palomar Technologies’ 3880 Die Bonder won the New Product Introduction (NPI) Award for Bonders. Circuit Assembly’s NPI Awards recognize the leading new products for electronics assembly during the past 12 months.  An independent panel of practicing industry engineers selected the recipients and then presented the awards during a ceremony at the IPC Apex Expo in Las Vegas.

The judges evaluated the submitted entries based on the following criteria:3880.jpg

  • Creativity and innovation
  • Compatibility with existing technology
  • Cost-effectiveness
  • Design
  • Expected reliability
  • Flexibility
  • Expected maintainability/ease of repair
  • Performance
  • User-friendliness
  • Speed/throughput

The new 3880 Die Bonder, the latest addition to the Palomar Technologies suite of die attach solutions, combines fine placement accuracy, fast tool indexing time, excellent tool planarity, and position precision making it the most advanced die bonder platform available today. It features a new fully integrated Z-Theta bidirectional bond head enabling improved reliability and uniformity across a wide range of applications. 

The new high precision bidirectional turret wheel ensures planarity of all pick tools without the need for individual leveling. This allows rapid tool changes without impacting process set up. Its large work envelope is ideal for a versatile automated die bonder capable of handling many different part types, presentation options, and application processes.3880_Bond_Head.pngAmong the innovations on this cutting-edge machine is the ability to hit Palomar's best accuracy and repeatability specs over a wider range of applications and conditions. This bonder is built upon a rich set of pick and place features, options, and capabilities. A complete redesign of the bond head incorporates a voice coil actuator, allowing for improved gram bond forces, improved linearity, and the bidirectional tool indexing which comes standard.

In addition, the 3880 Die Bonder is already compatible with Palomar’s VisionPilot® vision system. It utilizes advanced geometric pattern matching technology to reliably and accurately locate parts. Even under the most challenging conditions, this exclusive Palomar Technologies software can significantly reduce or eliminate fixturing requirements and costs. For locating parts or features, VisionPilot provides the maximum inspection yield and reliability available in a vision system.

Download the following resources for more information:

3880 Data Sheet Buyer's Guide eBook VisionPilot Data Sheet
3880 die bonder Top Considerations When Purchasing A Bonder VisionPilot Data Sheet

 

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Media Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760.931.3680

Tags: Awards, NPI Awards, VisionPilot, 3880

Visit Palomar Technologies at OFC 2016

Posted by Katie Finney on Tue, Mar 22, 2016

Carlsbad, CA – March 22, 2016 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced they are exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) at booth #1814 on March 22-24 in Anaheim, CA. Stop by their booth to learn more about solutions from Palomar Technologies and SST International.

With over 13,000 attendees and over 65 countries represented, OFC is the largest global conference and exposition for optical communications and networking professionals. According to OFC, some of the exhibition’s features this year are:

  • Exhibits from major international companies. Exhibitors include network and test equipment vendors, systems and component manufacturers, fiber cable and specialty fiber manufacturers.
  • Two Exhibit Hall theaters of business programming, featuring presentations by experts from major global brands and key industry organizations.
  • Local Representation from more than 100 California-based companies on the exhibit floor.

Palomar Technologies Solutions
Palomar Technologies’ Assembly Services is a perfect-fit solution for optoelectronic packaging without investing in capital equipment. This minimizes the customer’s project risk and accelerates time-to-market while maintaining the strong and dependable support of a trusted partner, ensuring a sustainable competitive advantage.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760-931-3680

 

 

Tags: Announcements, Assembly Services, OFC

Palomar Technologies Performs Live Demonstrations at SEMICON China 2016

Posted by Katie Finney on Tue, Mar 08, 2016

Carlsbad, CA—March 8, 2015—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, announced they will be present at SEMICON China March 15-17, 2016 at the Shanghai New International Exhibition Center. SEMICON China “connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China”.

Palomar Technologies is looking forward to showcasing and providing live demonstrations of their 9000 Wedge Bonder and their new 3880 Die Bonder. To view the live demonstrations and learn more about Palomar, stop by the Be First Technology Co., Ltd. booth located at booth #4667. You can also learn more about Palomar Technologies by stopping by the Beijing Asia Science & Technology Co., Ltd booth located at booth #2443.

Palomar Technologies' new 3880 Die Bonder features a fully integrated Z-Theta bidirectional bond head enabling reduced maintenance and uniformity across a wide range of applications. The new machine’s combined fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Presentation options include wafer, waffle/gel pak, tape and reel, boat, and carriers. Custom stages are also available.3880_Bond_Head.png

The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. The 9000 Wedge Bonder offers ultimate control and flexibility to change from a 45-60° wire feed range to 90° deep access with only a clamp change on the robust, theta-rotation bond head. No need for multiple expensive bond heads!Modern Wedge Bonding eBook

 The Palomar Asia office may be contacted online: www.palomartechnologies.com/contact-palomar-technologies-asia/

Download these resouces for more information:

3880 Data Sheet Epoxy Die Attach eBook 9000 Data Sheet
3880 die bonder epoxy die attach,daubing, epoxy dispensing, high-precision component attach 9000 Wedge Bonder data sheet

 

Tags: SEMICON China, 9000 Wedge Bonder, 3880 Die Bonder

Palomar Technologies Performs Live Demonstrations at Productronica 2015

Posted by Katie Finney on Tue, Nov 10, 2015

Carlsbad, CA—November 10, 2015—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be performing live demonstrations of the 8000i Wire Bonder, 9000 Wedge Bonder, and SST International’s Model 5100 Vacuum Pressure Furnace at productronica, held in Munich on November 10-13, 2015. The demonstrations will be taking place at their booth located in Hall B3, Booth 302 at this year’s international trade fair for innovative electronics development and production.

8000i Wire Bonder 9000 Wedge Bonder


Productronica is the perfect platform for live demonstrations of the latest products and solutions, concentrated to a world-wide audience of hybrid manufacturers. It is not only the perfect opportunity for attendees to learn more about and see Palomar Technologies’ products in action, but it is also a perfect opportunity for attendees to learn more about SST International’s products including their Model 5100. Recently, Palomar Technologies acquired SST International as a partner in providing customers with total solutions. We look forward to sharing with attendees how our systems complement one another, as well as demonstrating our existing products live.

About SST International
SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment. For more information, visit www.sstinternational.com.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Download these resources for more information:

8000i Data Sheet 9000 Wedge Bonder SST Model 5100
 8000i wire bonder, ball bumper, i2Gi  9000 Wedge Bonder data sheet  Model 5100 acuum pressure furnace, SST Microelectronics

 

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EMEA Contact
Mr. Josef Schmidl
Managing Director
Palomar Technologies GmbH
jschmidl@palomartechnologies.de | +49 (9131) 48009-30

Media Contact
Katie Finney
Marketing Specialist
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760.931.3680

Tags: Announcements, productronica

Palomar Technologies Exhibits at the IMAPS 48th Annual Symposium on Microelectronics

Posted by Katie Finney on Tue, Oct 27, 2015

Carlsbad, CA – October 27, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will be exhibiting at the IMAPS 48th International Symposium on Microelectronics. Visit us at booth #511 on October 27-29 at the Rosen Center Hotel in Orlando, Florida to learn more about our products, including the NEW 3880 Die Bonder.

The 3880 Die Bonder is an ultra-versatile, ultra-flexible die bonder with an all new Z-theta bidirectional bond head with voice coil technology. The 3880 can solve various applications challenges: MEMS, HB/HP LED assembly, RF power amplifiers, and microwave modules. Read more about the 3880 and view more applications examples here.

3880 Die Bonder

Technical Programs
In addition to the exhibits, the symposium will feature exciting keynotes, industry panels, and technical speakers on “The Future of Packaging”. This forum is the largest exchange of technical information and industry leaders, encompassing 3 days, 30 sessions, 5 keynote speakers and 160+ speakers on microelectronics, assembly, interconnect, and packaging. Our own Chief Technical Officer, Dan Evanswill be presenting on copper wire refinements and alternatives at a technical session on Wednesday. For more information on the conference and the other technical sessions being offered, go to www.imaps2015.org

Also, don’t forget to grab a delicious treat during the Dessert “Happy Hour”, sponsored by Palomar Technologies, Tuesday from 3:15-4:15pm. 

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

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Tags: Announcements, IMAPS, microelectronics

Palomar Technologies Introduces the Latest in Die Bonding Technology: The 3880 Die Bonder

Posted by Katie Finney on Tue, Sep 22, 2015

Carlsbad, CA – September 22, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the launch of its latest product: the 3880 Die Bonder. The 3880 Die Bonder features a new fully integrated Z-Theta bidirectional bond head enabling improved reliability and uniformity across a wide range of applications.  The new machine’s combined fine placement accuracy, fast tool indexing time, excellent tool planarity and position precision make it the most advanced die bonder platform available today.

3880_bondhead_8.19.15

The new high precision bidirectional turret wheel ensures planarity of all pick tools without the need for individual leveling. This allows rapid tool changes without impacting process set up.                                                                  New Z-Theta Bidirectional Bond Head

Its large 36 x 20 inch work envelope is ideal for a versatile automated die bonder capable of handling many different part types, presentation options, and application processes.     

Among the innovations on this cutting-edge machine is the ability to hit Palomar's best accuracy and repeatability specs over a wider range of applications and conditions. The 3880 Die Bonder is built upon a rich set of Palomar’s pick and place features, options, and capabilities. Plus, a complete redesign of the bond head incorporates a voice coil actuator; allowing for 5-1000 gram bond forces, improved linearity, and the bidirectional tool indexing comes standard.

3880_photo_9.16.15In addition, the 3880 Die Bonder is already compatible with Palomar Technologies’ VisionPilot®. It utilizes advanced geometric pattern matching technology to reliably and accurately locate parts and is built upon Cognex® vision technology. Even under the most challenging conditions, this exclusive Palomar Technologies software can significantly reduce or eliminate fixturing requirements and costs. For locating parts or features, VisionPilot® provides the maximum inspection yield and reliability available in a vision system. 

                                    Download 3880 Data Sheet:

3880 die bonder

About Palomar Technologies

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.  

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Media Contact
Katie Finney
Marketing Communications Manager
Palomar Technologies, Inc.
kfinney@bonders.com | +1 760.931.3680

Tags: die bonder, 3880, bidirectional bond head, z-theta, best accuracy