Carlsbad, CA—April 19, 2016—Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they will be exhibiting at SEMICON Southeast Asia at the SPICE Arena in Penang, Malaysia on April 26-28 in booth #209. They will also be exhibiting at SMT Hybrid Packaging in Nuremberg, Germany on April 26-28 in booth 7A-205.
Palomar made several noteworthy announcements in 2015, including the launch of its new 3880 ultra-flexible die bonder and its acquisition of SST International.
Talk With Palomar About Die and Wedge Bonding
The 3880 Die Bonder is the next-generation die bonder with an improved bond head design, integrated with a Z-Theta leveling mechanism and high speed bi-directional 8-tool turret. Because of the 3880’s inherent highly repeatable planarity feature, wide force range, and fast tool change, customers in the optoelectronic and RF/wireless device packaging markets have seen the greatest increases in performance and throughput. Also new to the Palomar suite of solutions is the 9000 Fine Wire Wedge Bonder. Devised and designed for modern wedge bonding, the 9000 uses a voice coil driven bond head with interchangeable clamps for 45-60° and 90° feed angles. Customers doing ribbon bonding benefit from being able to use the same clamp with ribbon as they do with round wire. Because the bond head itself turns on a single mechanism, there is no twisting of ribbon or wire during the bonding process. The feed path is shorter, the control better, and the precision of wedge bonding greatly improved.
SST Vacuum Reflow Systems
Exhibiting with Palomar at SEMICON Southeast Asia will be SST Vacuum Reflow Systems. Palomar acquired SST in March of 2015, and have been actively integrating the SST solutions within Palomar’s suite of advanced packaging and assembly products. A critical feature of SST’s unique position is its expertise in designing and machining graphite tooling plus process expertise. With refined process expertise, SST provides a void-free eutectic attach, hermetic package sealing, glass to metal sealing, and wafer level bonding.
Palomar Technologies GmbH will also be exhibiting at SMT Hybrid Packaging next week in Nuremberg, Germany. The 9000 Wedge Bonder will be on display, as well as SST's 5100 Vacuum Pressure Furnace. They would love to speak with you at the show about packaging challenges and possible solutions.
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
About SST International
SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering, brazing, glass-sealing and wafer bonding equipment to the worldwide electronics industry. SST’s team of leading engineers and technologists are constantly advancing state-of-the-art microelectronic package assembly techniques, processes and equipment. For more information, visit www.sstinternational.com.
Mr. PH Chan
General Manager, Asia Pacific
Palomar Technologies (S.E. Asia) Pte Ltd | (+65) 6686-3096
Mr. Josef Schmidl
Managing Director, Europe
Palomar Technologies GmbH | 49 (9131) 48009-30
Marketing Communications Manager
Palomar Technologies, Inc.
email@example.com | +1 760.931.3680