选择楔键合机的准则 (Criteria on Wire Bonder Selection: Chinese Translation)
For a version of this blog in English, click here. 第一台键合机是于 1957 年设计的,它是一台热压缩楔键合机。超声波键合是在 1960 年代初引入。热超声键合于 1970 年首次亮相。 到了80 ...
Posted by Katie Finney on
For a version of this blog in English, click here. 第一台键合机是于 1957 年设计的,它是一台热压缩楔键合机。超声波键合是在 1960 年代初引入。热超声键合于 1970 年首次亮相。 到了80 ...
Posted by Katie Finney on
Program management is often an overlooked necessity when working with an OEM for automated microelectronics equipment. Organizations need ...
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Cost and availability of spare parts are of considerate interest to anyone who currently owns a piece of capital equipment or anyone ...
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There are a myriad of differences between eutectic or epoxy die attach methods. There are some obvious trade-offs and benefits to both, ...
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Are you preparing to ramp up production, but not sure how to achieve maximum throughput? How confident are you that your current production ...
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The decision process to purchase a high-end, “big ticket item” piece of microelectronics manufacturing equipment is not always a simple ...
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With the growing installed base of 3800 Die Bonder customers and the long-standing presence of the 8000 Wire Bonder across the APAC region, ...
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Through decades of experience with automatic, highly versatile and precise die attach systems, I have learned a few important lessons in ...
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I think none of us would hesitate to say that things change pretty fast in this modern world. The pace of technology is just staggering. ...
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Today's production facilities have their own unique set of components, design characteristics and assembly requirements. Before purchasing ...
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