PTI Blog

For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...

Posted by Janine Powell on June 24

[For English translation, click here.] La fiabilité d’un câblage par la technique nommée « Ball bonding » requière usuellement l’ajout ...

Posted by Palomar Technologies MarCom Team on February 12

With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the ...

Posted by Janine Powell on February 5

Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...

Posted by Janine Powell on January 22

SEMICON West is the flagship annual event for the microelectronics industry, with 2012 bringing together 690 exhibiting companies from 21 ...

Posted by Palomar Technologies MarCom Team on July 24

To live today without the assisitance and support of microelectronic-controlled devices is borderline unthinkable—unless you are romantic ...

Posted by Palomar Technologies MarCom Team on July 17

SMT Hybrid Packaging is Europe's leading event on system integration in microelectronics. From 8–10 May, 2012, over 565 exhibitors ...

Posted by Palomar Technologies MarCom Team on May 22

Mobile electronic products continually require finer geometries for packaged integrated circuits. Wireless phones, PDA and digital cameras ...

Posted by Palomar Technologies MarCom Team on May 15

SEMICON Taiwan is the premier event for microelectronics manufacturing in Taiwan, providing a platform to connect with the companies, ...

Posted by Palomar Technologies MarCom Team on September 20

Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps and specialty interconnects. Multipurpose ...

Posted by Palomar Technologies MarCom Team on July 15

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