Mobile electronic products continually require finer geometries for packaged integrated circuits. Wireless phones, PDA and digital cameras continue to merge into a common device that will benefit from finer pitch and lower profile wire bonding or ball bumping for flip chip, stacked chip and other advanced packaging technologies. Inherent variations in materials, tools and process can cause variations in ball shape and size, stitch shape, bond quality, and thus, yield.

In anticipation of the market’s growing demand for MEMS products, a high-volume, high-yield manufacturing solution is the answer: Design for Automation. MEMS component designers must do the upfront work in designing their MEMS devices for volume production. The process requires care and due diligence. The value brought to the customer in lowered costs, and to the manufacturer in increased throughput and yields, translates to success all around.

What do professional hockey and microelectronics have in common? A lot if you’re talking about enhanced goal-vetting capabilities.

Accurately locating a wide variety of components using automatic vision referencing involves a comprehensive system of optics, lighting, vision processing engine and higher level referencing alignment algorithms. Palomar Technologies’ design is based on decades of experience in die bonding applications. Red-blue lighting in combination with the multiple field of view optics for the lookdown camera and the industry-proven Cognex Vision System’s processing capabilities provide a robust and powerful referencing engine for the most demanding applications.

我们经常听到客户问一个同样的问题,就是关于图像识别照明灯光的颜色。到底是越多种颜色越好呢，或是红蓝绿混合的白光，或是单色好呢？

Palomar Technologies recently met with Stephen Duffy, director of sales and marketing at Optocap (based in Livingston, Scotland), to learn more about his company’s strategic presence in the European Union (EU) as a high-mix, low-/medium-volume contract assembly laboratory.

Having undergone significant changes since the collapse of the Soviet Union, Russia is moving from a centrally planned economy to a more market-based and globally integrated economy. Recently in 2008/2009, Russia—which is the ninth largest economy in the world—experienced the first recession after 10 years of economincal growth, stablizing in late 2009/2010. However, as opposed to the majority of the world, Russia’s economy has not been greatly affected by the world-wide financial crises in 2009/2010.

Today, the demands for smaller packages require highly reliable thermal coupling to associated packages. Therefore, bondline thickness must be carefully controlled. Hybond Inc.’s patented bond-line thickness measurement and die placement technology is incorporated on its model EDB-141 die bonder to greatly improve yields and thermal performance of critical die. The Hybond EDB-140B and EDB-141 series bonders use a patented approach for measuring die and package stack-up height to assure consistent bond-line thickness regardless of adhesive viscosity or die size. A built-in micrometer allows the operator to set bond-line thickness accurate within 10μm.

Today's telecommunications/datacom industry is coping with its own technical challenges in processing capabilities through the continuous juggle of requirements between greater electrical performance and reduced package sizes. Automatic eutectic attachment techniques, which are desirable for high-performance and high-capacity die attach applications, are constantly in high demand.

The medium used for component attach is key aspect of LED assembly. There is ample evidence that gold-tin (Au/Sn) yields the highest performance, although assembly costs may increase via cycle time. High-volume light engines can be assembled with silver epoxy to provide highest throughput.