EXPECT HIGHER STANDARDS!
Introducing the Palomar 6532HP – 1.5 micron die bonding placement accuracy for the optoelectronics market.
Exceeding standards, the 6532HP is exceptionally accurate, the newest high-precision, high-performance, high-production die bonder in the world. Fully automated, high capacity feeders maximize your production and ROI.
Download the data sheet here.
Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head make it the fastest and most reliable multiple die-type bonder on the market.
The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. Its key differentiators - such as the large work area, high precision and no surface touch - help customers achieve modern wedge bond requirements.
Carlsbad, CA – October 30, 2018 – Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, today announced that Evan Hueners, Product Marketing Manager for Palomar Technologies, will present Advanced Photonic Packaging: Empowering IoT and Beyond at the Photonics@SG 2018 Conference and Exhibition at the Nanyang Technological University in Singapore on November 26, 2018. READ MORE
by Evan Hueners
Can your manufacturing facility afford to lose $100,000 an hour to machine downtime? According to Information Technology Intelligence Consulting, 98% of all organizations with over 1,000 employees report that a single hour of downtime costs their company over $100,000, with 33% reporting downtime costs as high as between $1-5 million. READ MORE