EXPECT HIGHER STANDARDS!
Introducing the Palomar 6532HP – 1.5 micron die bonding placement accuracy for the optoelectronics market.
Exceeding standards, the 6532HP is exceptionally accurate, the newest high-precision, high-performance, high-production die bonder in the world. Fully automated, high capacity feeders maximize your production and ROI.
Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head make it the fastest and most reliable multiple die-type bonder on the market.
The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. Its key differentiators - such as the large work area, high precision and no surface touch - help customers achieve modern wedge bond requirements.
IMAPS Device Packaging
March 6-7 | Booth #63
Fountain Hills, Arizona
March 14-16 | Hall N3 Booth #3639
OFC Optical Fiber Communication Conf.
March 13-15 | Booth #3646
San Diego Convention Center, CA
by Janine Powell
Carlsbad, CA – October 10, 2017 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that they will be... READ MORE
by Dr. Anthony O'Sullivan
Our latest blog interrupts the series on Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems to bring readers important news on Palomar’s exciting new addition to its 3880 Bonder family, the 6532HP, which is being launched at... READ MORE