EXPECT HIGHER STANDARDS!
Introducing the Palomar 6532HP – 1.5 micron die bonding placement accuracy for the optoelectronics market.
Exceeding standards, the 6532HP is exceptionally accurate, the newest high-precision, high-performance, high-production die bonder in the world. Fully automated, high capacity feeders maximize your production and ROI.
Download the data sheet here.
Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head make it the fastest and most reliable multiple die-type bonder on the market.
The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. Its key differentiators - such as the large work area, high precision and no surface touch - help customers achieve modern wedge bond requirements.
European Conference on Optical Communication (ECOC)
Rome, Italy | booth #677
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Palomar Technologies Enlarges Engineering Lab to Meet Increased Demand for Photonics Solutions
Carlsbad, CA – September 18, 2018 – Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, announced it is enlarging its engineering laboratory to meet the increased demands of customers developing advanced photonics solutions, such as LiDAR, 3D sensors, gene sequencing and high power LEDs. The upgraded laboratory will be used to further strengthen Palomar’s focus on partnering with customers, giving them insight into, and an opportunity to contribute to, Palomar’s technology road map and development of the next generation of systems and assembly solutions. READ MORE
by David Rasmussen
Photonic integrated circuits (PIC) have become an attractive platform for data center, sensing and medical devices. Thermal cameras and LIDAR for tomorrow’s semi-autonomous and autonomous vehicles, high power LEDs, photo sensors, 3D sensing, gene sequencing – are all just a few of the applications being developed today using photonics technology. READ MORE