EXPECT HIGHER STANDARDS!
Introducing the Palomar 6532HP – 1.5 micron die bonding placement accuracy for the optoelectronics market.
Exceeding standards, the 6532HP is exceptionally accurate, the newest high-precision, high-performance, high-production die bonder in the world. Fully automated, high capacity feeders maximize your production and ROI.
Download the data sheet here.
Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head make it the fastest and most reliable multiple die-type bonder on the market.
The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. Its key differentiators - such as the large work area, high precision and no surface touch - help customers achieve modern wedge bond requirements.
CARLSBAD, CA – December 3, 2018 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, today announced new epoxy die attach capabilities for silver sintering. Developed to meet growing demands for RF GaN power amplifiers, which are a core requirement for the successful rollout of 5G networks around the world, the new silver jet dispensing capabilities are an enhancement to the already wide breadth of Palomar Technologies solutions for the telecom/Datacom markets. READ MORE
by Trent Nash
The semiconductor packaging industry continues a relentless pursuit to make smaller packages with higher throughput. The industry demand for smaller components requires manufacturers to adapt by developing new processes. Achieving consistent, quality Au Planar bumps has been a challenge that the industry has been trying to meet for years. In this case study, we explore these shrinking specifications of wire bonding requirements in regards to ball bump mashed ball diameter and top heights for flip chip applications and how to achieve them. READ MORE