EXPECT HIGHER STANDARDS!
Introducing the Palomar 6532HP – 1.5 micron die bonding placement accuracy for the optoelectronics market.
Exceeding standards, the 6532HP is exceptionally accurate, the newest high-precision, high-performance, high-production die bonder in the world. Fully automated, high capacity feeders maximize your production and ROI.
Designed for fully automated epoxy and eutectic die attach processes, the 3880 Die Bonder combines fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Its innovative integrated Z-Theta bidirectional 8-tool bond head make it the fastest and most reliable multiple die-type bonder on the market.
The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. Its key differentiators - such as the large work area, high precision and no surface touch - help customers achieve modern wedge bond requirements.
Carlsbad, CA – March 13, 2018 – Palomar Technologies, Inc. is delighted to announce the introduction of their newest die bonding system: the 6532HP (HP for High Precision, High Production, High Performance). Developed for the demanding needs of the optoelectronics industry, the 6532HP exceeds industry standards for placement accuracy, production speed and high volume capacity. READ MORE
by Dr. Anthony O'Sullivan
The following blog is the first in a two-part finale ending a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems. Our aim has been to give our readers a glimpse of humanity’s shared technological future, as well as hints regarding Palomar’s own roadmap. READ MORE