About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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Vacuum reflow is a process that incorporates thermal profiles with precise control of pressure in the bonding environment. The combination of pressure variation, control of the gases in the environment, and precise thermal profiles makes fluxless, nearly void-free bonds possible. 

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Glass to metal and glass to glass sealing involves the softening or melting of glass and subsequent wetting to glass or metal surfaces to form a seal that is hermetic and electrically insulated.

High vacuum MEMS packaging is designed for advanced micro-electro-mechanical systems (MEMS) devices that require internal package vacuum levels on the order of 1 millitorr over the life of the device. 
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Hermetic package sealing processes with solder or glass frit are used to isolate critical microelectronic circuits from the surrounding environment.

Eutectic die bonding, sometimes known as eutectic die attach or fluxless eutectic solder attach, is a process that forms high thermally and electrically conductive bonds that are often needed for the densely packed circuits in today’s dies.
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Solder paste die attach or reflow attach uses solder paste to attach SMT components.  It can be processed at the same speed as epoxy die attach, yet provides the high thermal conductivity needed for the components to function correctly.
Silver sintering die bonding or pressureless sintering die attach is unique from both solder and epoxies; it neither cures nor does it reflow. Sintered paste instead goes through a process akin to solid diffusion.
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