Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

Learn More


Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

Learn More


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

Learn More


Get access to our entire knowledge database: read blog articles and download materials.

Learn More

Contact Us

Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

Learn More

Press Release

New Palomar Asia Facility for Demonstrations, Support & Training

Posted by Palomar Technologies MarCom Team on Tue, Aug 06, 2013 @ 01:00 PM

Carlsbad, CA – August 6, 2013 –Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the opening of its new demonstration and applications development office, located in Singapore, effective immediately.

Palomar Technologies opening Ribbon Cutting Palomar Technologies Asia Singapore office reveals company logo

Palomar Technologies (SE Asia) Pte Ltd., (“Palomar Asia”) has been headquartered in Singapore since its establishment in August 2000—five years after Palomar Technologies, Inc., evolved as a former subsidiary of the Hughes Aircraft’s Industrial Product Division. Since the initial opening of Palomar Asia, the office has generated substantial business growth year-after-year and quickly became recognized for its superior support of Asia-Pacific customers requiring automated wire bond and die attach equipment.

The new Palomar Asia facility builds upon the established base of customer support, evolving into a “one-stop shop”  to offer full-capacity support. For example, the new facility supports more high-accuracy wire bond and die attach demonstrations on automated bonders, as well as contract manufacturing for complex hybrid applications through Palomar Technologies Assembly ServicesTM.

Process Development Services data sheet


The automated microelectronics manufacturing requirements for the APAC region spans markets from aerospace/defense, optoelectronic, LED, RF/Wireless and medical for high-accuracy die attach and high-reliability wire bonding. Even amidst recent world-wide economic strain, the APAC region has rapidly grown for Palomar Asia—for both personnel and customer installed base. Palomar Technologies’ most popular large work area die attach platform—the ultra-flexible 3800 Die Bonder— and the “workhorse” Au wire/ball bump, deep access platform—the 8000 Wire Bonder—have continually exceeded customer expectations for quality, accuracy and process expertise support.

At SEMICON West 2013 in San Francisco, CA, Palomar Technologies launched the new 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM). Cleverly pronounced “iggy”, i2Gi is an unparalleled feature implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bondersi2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation. 

Click here to read the launch press release for the 8000i Wire Bonder with i2Gi.

To meet the needs of its expanding installed base, Palomar Asia has tripled its workforce, mostly in the ranks of direct field service engineers. “Having direct field service engineers in every region with Palomar Technologies equipment has been key to our success,” affirms PH Chan, Palomar Asia Managing Director. “By offering expert hardware, process and application support directly to our customers, we are able to quickly resolve the most complex microelectronic assembly challenges at our customer’s sites.”

Since his arrival at Palomar Asia in 2010, Mr. Chan has developed and expanded a local APAC Spare Parts Depot, increased the number of APAC sales representatives and accelerated the regional marketing presence in Asia’s largest industry tradeshows.

August 2013 marks the beginning of a new era for Palomar Asia. The new Palomar Asia facility offers a new clean room and demonstration laboratory, outfitted with wire bonding and die attach capabilities, as well as measurement and test equipment.

The 8000i Wire Bonder was showcased at the Palomar Asia office grand opening event, held on Friday, August 2. The event hosted customers, suppliers and friends of Palomar Asia and included opening ceremonies such as traditional Chinese lion dance and pineapple roll for good luck.

Palomar Technologies Singapore microelectronics manufacturing center new Palomar Technologies Asia Singapore office opens with traditional Chinese prosperity ceremonies

Contact Palomar Asia for tours, demonstrations and training courses.
Palomar Technologies (S.E. Asia) Pte Ltd
8 Boon Lay Way #08-09
Tradehub 21
Singapore 609964
Tel: (+65) 6686-3096
Contact online: http://www.palomartechnologies.com/contact-palomar-technologies-asia


Palomar Asia Contact
Mr. PH Chan
Managing Director
(+65) 6686-3096

Palomar Technologies Media Contact
Mrs. Jessica Sylvester
Marketing Communications Manager
+1 (760) 931-3681