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Powering the Connected World

Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assemblies used in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with our Advanced Solutions Division for specialty OSAT/process development and technical services. Palomar delivers improved production quality and yield, reduced assembly times, and rapid ROI.

Built in the USA.
Trusted worldwide.

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Headquartered in Carlsbad, California, Palomar equipment is designed and manufactured in the USA. Palomar offers global sales, service, and application support from its offices in the USA, Asia, and Europe.

With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services.

Strategic Technology Alliances

As part of Palomar’s total solution, Alliance products are offered in conjunction to work hand-in-hand with Palomar’s line of die attach, wire bond and vacuum reflow systems. Palomar’s service team and engineers are trained to support this equipment through the warranty period and for the life of the equipment.

royce

Pull/Shear/Die Sorting Systems from Royce Instruments

Royce Instruments’ bond testing systems can handle a variety of testing applications, such as automated die sorting, semi-automatic die handling, or wire pull bond testing.
gdpGlobal

Precision Fluid Dispensing Systems from GPD Global

GPD Global’s precision fluid dispensing systems are designed for low-volume, high-mix, R&D, and high-volume 24/7 production. Applications include MicroVolume dots and lines, Underfills, Encapsulations, Lens Fixing, and Masks.
hyBond

Manual Bonders from Hybond

Hybond’s table top wire and wedge bonders and die bonders offer customers a variety of adjustable height heated work stages.
automation

Automated Plasma Cleaners from SCI Automation

SCI Automation specializes in the design and manufacturing of integrated plasma (or vacuum) systems, which are used around the world in vacuum and plasma applications.

Affiliations

Palomar® Technologies is proud to be affiliated with the most highly regarded and respected organizations in the industry.

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carlsbad
epic
SEMI-4c
imaps
wtc
iso
lux-photo
smta
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Distinct Technologies 

These distinct technologies make Palomar® Technologies a global leader in high accuracy die attach, wire bond, and vacuum reflow technologies. 

  • Adaptive Bond Deformation™ (ABD) for ultimate control over ball and stitch deformation Palomar Technologies patent US 7,845,542 B2
  • Bond Data Miner™ (BDM) is a software feature that provides part traceability, predictive process capability, and monitors machine fitness
  • VisionPilot® with Radar Referencing® and Vision StandardizationTM (available on die bonders and wire bonders).
  • Bi-Directional 8-Position Tool Turret, integrated Z-Theta
  • Apparatus for Rapid Cooling of Substrates Utilizing a Flat Plate and Cooling Channels (SST International U.S. Provisional Patent Application Serial No. 62/351,817)
  • Low Voiding Solder Paste Profile for Microelectronic Packaging (SST International U.S. Provisional Patent Application Serial No. 62/357, 495)
  • Enhanced Loop Mode™ (ELM) provides exceptional long, low loop capability, with loops up to 10mm.
  • Dual-Axis Bond Head, Digital Dispensing™ for very precise dispensing for low volume application Dual-Axis Bond Head Palomar Technologies patent US 6,102,275
  • High Vacuum MEMs packaging with thermal Getter firing, and low chamber virtual leak design.
  • Low void solder technology utilizing Vacuum and Pressure with precise pressure and temperature control.
  • Free floating weights for optimized solder reflow.
  • Two zone heater control for large batch furnace temperature uniformity.
  • Semiconductor grade graphite for:
    • Heater for high power density, rapid temperature rise, long life and low cost of ownership. Carrier boat and fixtures to accommodate rapid temperature rise without material warpage, durability and long life.
    • Graphite particle elimination.
    • Spring design and manufacturing to hold parts or carrier boats.
    • Design and fabrication of complex and layered packaging of micro-electronics assemblies.
  • Cold wall process chamber design with high temperature application of 1000 Centigrade. For precise temperature control at extremely high temperatures. The chamber can be both high and low vacuum design.
  • Intelligent Interactive Graphical Interface® or i2Gi (for wire bonding)
  • Measuring Electrical Interconnect Integrity planarBump™ An advanced packaging option on the 8100 Wire Bonder and Ball Bumper that uses gold wire to produce tailless ball bumps
  • Platinum Wire Bonding
  • Combination Wire Bonder: wire bonding, stud bumping, ball bumping, wafer bumping