PTI Blog

Integrating i2Gi™ onto an 8000 Wire Bonder (i2Gi™软件与球焊机8000的结合)

[For the English version, click here.] 我们可以肯定地说,任何利用自动球焊机的单位都会不断致力于提高生产力和效率。电脑及软件的性能在维持最佳生产状况这方面是至关重要的,特别是对于复杂的混合生产。智能交互式图形界面(Intelligent ...

Posted by Janine Powell on

可靠性超高的键合方案 (Ultra High-Reliability Wire Bonding)

[For English, click here.] 为了提高第二焊接点的可靠性,传统上是在第二个焊接点上焊上一个球(security bond)。虽然这种方法确实创造一个更可靠的焊线,它同时也导致产量的下降。这方法只能使用正向的焊线动作。 ...

Posted by Palomar Technologies MarCom Team on

Au Ball Wire Bonding with Heated Tool

Gold (Au) ball wire bonding is still the predominate method for interconnects in microelectronics. Industries are further utilizing novel ...

Posted by Janine Powell on

Comparing Au, Pt, Ag and Cu Wire Bonding

With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the ...

Posted by Janine Powell on

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