Ball Bonding vs. Wedge Bonding
For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...
Posted by Janine Powell on
For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...
Posted by Janine Powell on
[For the English version, click here.] 随着传统的混合和光电子封装频率上升,导致基本的键合工艺产生问题。主要的问题是反应性电感的产生。除此之外,反应性电容也是一个问题。但是,导线的形状从圆形改为扁带形就能直接影响反应性电感这个最关键问题。 ...
Posted by Janine Powell on
As frequencies go up in traditional hybrid and optoelectronic packaging, the first level wire interconnect itself can become a problem. The ...
Posted by Janine Powell on
Yole Développement recently met with David Rasmussen, Assembly Services general manager, to discuss automated die bonding tools for today's ...
Posted by Palomar Technologies MarCom Team on
In microelectronics production environments, bond testing can provide a means of evaluating bond quality and verifying bond consistency and ...
Posted by Janine Hueners on
LEDs 2012 was another well-attended international conference, held at the Hilton on the San Diego bay. Attendance has been up year over ...
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High-reliability wire bonding traditionally required the addition of a security bond over the stitch—or second bond—of each ball bonded ...
Posted by Palomar Technologies MarCom Team on
One frequently asked question when addressing high-power wire bonding applications is “how many wires do I need?” As a common ...
Posted by Palomar Technologies MarCom Team on
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