Eutectic Wafer-Level Packaging (WLP) For Compact Portable Devices

Wafer-Level Packaging (WLP) has become widely accepted in the microelectronics industry due to the demand for smaller form factor in ...

Posted by Palomar Technologies MarCom Team on September 15

MEMS the Word – Recap of MEPTEC MEMS 2011

MEPTEC MEMS, held this year in the heart of San Jose, CA, is traditionally a niche conference with a small exhibit show floor. This ...

Posted by Palomar Technologies MarCom Team on May 23

SMT Hybrid Packaging 2011 in Nuremberg, Germany

Situated in the heart of Bavaria and with over half a million inhabitants, Nuremberg is one of Europe’s most beautiful cities, rich in ...

Posted by Palomar Technologies MarCom Team on May 5

SEMICON China 2011 Reflection | Showcasing the 3500-III Die Bonder

美国PALOMAR 公司成立于1975年,早期隶属于美国休斯航空公司(Hughes Aircraft )的工业产品事业部,主要从事半导体设备的开发与研究.PALOMAR 公司至成立之日就致力于服务美国军工和高科技企业领域高端封装设备的供应.在该领域有70%以上的市场. ...

Posted by Palomar Technologies MarCom Team on March 31

Component Design for Complex MEMS

For today's MEMS manufacturer, low volume and high complexity are no longer subject to only manual packaging processes. Automation is here, ...

Posted by Palomar Technologies MarCom Team on September 28

Automating MEMs Packaging

The Micro-Electro-Mechanical Systems (MEMS), which once existed only in the university laboratory, are common in many commercial products ...

Posted by Palomar Technologies MarCom Team on September 17