AuSi and AuSn Eutectic Die Attach Case Studies
High power transistor, laser and LED devices require packaging to remove thermal energy from the die. Although some silver filled epoxies ...
Posted by Palomar Technologies MarCom Team on
PTI Blog
Gold Ball Bonding for LEDs and High-Power Applications
One frequently asked question when addressing high-power wire bonding applications is “how many wires do I need?” As a common ...
Posted by Palomar Technologies MarCom Team on
Semicon West 2010 - Preview
July 13th - The DAY We are now only days away from Semicon West 2010, which opens at 10 AM on Tuesday, July 13th at the Moscone Center in ...
Posted by Palomar Technologies MarCom Team on
Steady State Eutectic Attach using Force/Scrub
This is Part 3 of the Eutectic Die Bonding 101 series. In the previous 2 blogs, we discussed what "eutectic" means, the variables and ...
Posted by Palomar Technologies MarCom Team on
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