Micro-Dot Epoxy Pump Dispenser - GPD Fluid Dispense Solution

The search for a "complete, yet customized, solution to a microelectronics assembly requirement" is an all-too-common request from a ...

Posted by Palomar Technologies MarCom Team on August 7

5 Critical Process Points to Automating MEMS Packaging

In anticipation of the market’s growing demand for MEMS products, a high-volume, high-yield manufacturing solution is the answer: Design ...

Posted by Palomar Technologies MarCom Team on May 8

Accurate Bond-Line Thickness for Enhanced Performance of Critical Die

Today, the demands for smaller packages require highly reliable thermal coupling to associated packages. Therefore, bondline thickness must ...

Posted by on March 20

Evaluation of HB LED AuSn Preforms & Eutectic Solder Paste

The medium used for component attach is key aspect of LED assembly. There is ample evidence that gold-tin (Au/Sn) yields the highest ...

Posted by on February 28

Optoelectronic Products Case Studies for Micron-Level Placement Accuracy

Applications requiring ultra-high-placement accuracies of 1μm to 3μm are resurfacing in several optoelectronic applications such as Arrayed ...

Posted by Palomar Technologies MarCom Team on April 28

Die and Wire Attach Systems - Staying on the Technology Treadmill

I think none of us would hesitate to say that things change pretty fast in this modern world. The pace of technology is just staggering. ...

Posted by Palomar Technologies MarCom Team on February 25

Automated Eutectic Die Attach for Device Thermal Management

Device thermal management has become more essential as packages run at higher frequencies and higher power levels. Designers are thinning ...

Posted by Palomar Technologies MarCom Team on January 15