Happy New Year from Palomar Technologies CEO
I would like to take a moment and thank you for your subscription to the PTI Blog. I hope you have found each weekly post both insightful ...
Posted by Palomar Technologies MarCom Team on
PTI Blog
Eutectic Wafer-Level Packaging (WLP) For Compact Portable Devices
Wafer-Level Packaging (WLP) has become widely accepted in the microelectronics industry due to the demand for smaller form factor in ...
Posted by Palomar Technologies MarCom Team on
Big ROI from Small Footprint Die Bonders
Clean room space is expensive. Obtaining the highest component placement accuracies and the versatility of high-precision application ...
Posted by Palomar Technologies MarCom Team on
MEMS the Word – Recap of MEPTEC MEMS 2011
MEPTEC MEMS, held this year in the heart of San Jose, CA, is traditionally a niche conference with a small exhibit show floor. This ...
Posted by Palomar Technologies MarCom Team on
SEMICON China 2011 Reflection | Showcasing the 3500-III Die Bonder
美国PALOMAR 公司成立于1975年,早期隶属于美国休斯航空公司(Hughes Aircraft )的工业产品事业部,主要从事半导体设备的开发与研究.PALOMAR 公司至成立之日就致力于服务美国军工和高科技企业领域高端封装设备的供应.在该领域有70%以上的市场. ...
Posted by Palomar Technologies MarCom Team on
AuSi and AuSn Eutectic Die Attach Case Studies
High power transistor, laser and LED devices require packaging to remove thermal energy from the die. Although some silver filled epoxies ...
Posted by Palomar Technologies MarCom Team on
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