Computer and software performance is vital to maintaining peak production performance, especially for complex hybrid manufacturing. ...

Posted by Katie Finney on February 2

There was a time when our hi-rel customers would typically use what they called a “security bond” on the stitch bonds of their packages. ...

Posted by Katie Finney on January 26

For a version of this blog in English, click here. Récemment, Palomar Technologies a acquis SST International en tant que partenaire dans ...

Posted by Katie Finney on January 19

Each year we can look back and try to reconcile our good and bad projects. If we focus on the good, we will find the possibility of future ...

Posted by Katie Finney on January 12

Artificial graphite is a unique engineered material that finds many uses in microelectronics assembly. SST International is starting a blog ...

Posted by Katie Finney on January 5

Every year, International Microelectronics and Packaging Society (IMAPS) members are asked to select those who have done such notable work ...

Posted by Katie Finney on December 8

[For a version of this blog in English, click here.] 最近Palomar Technologies收购了 SST 国际作为合作伙伴,为我们的客户提供整体的生产解决方案。两家公司在很多领域都有不同的功能. ...

Posted by Katie Finney on December 1

The International Wafer-Level Packaging Conference (IWLPC) was held in San Jose, California in October. Over 650 industry experts were in ...

Posted by Katie Finney on November 24

For a version of this blog in English, click here. Si l’assemblage automatique d’équipements est l’activité principale de votre entreprise, ...

Posted by Katie Finney on November 17

Last month, we announced the latest addition to the Palomar suite of die attach and wire bonding solutions. This new machine is called the ...

Posted by Katie Finney on October 20