Wafer Level Packaging (WLP) provides for both interconnection and package sealing of circuits at the wafer level. Processes include flip chip solder reflow, solder lid sealing and wafer-to-wafer bonding using solder, glass, adhesives and direct fusion.
The 3190 is a high vacuum wafer bonder capable of wafer sizes to 6-inch (150 mm) diameter that provides precise automatic control of heating and cooling at temperatures up to 500°C (1000°C optional). Bellows-actuated clamping platens present uniform mechanical bonding forces up to 750 pounds (5,000 pounds optional) to the wafer pair. The 3190 also provides anodic (electrostatic) bonding capabilities with a high-voltage power supply.
The 1500 is a manually operated wafer aligner capable of aligning wafer sizes to 8-inch (200 mm) diameter. This clean-room compatible aligner includes two CCD cameras mounted on microscope zoom lenses and connected to a split-screen 17-inch LCD monitor. Fiber optic light rings and illuminators are provided for wafer fiducial illumination. The camera lenses are mounted on fully adjustable (X-Y-Z-theta) stages for positioning over wafer fiducials.