Solution_Hermetic-Package-Sealing_Cropped.png

3130 Vacuum Pressure Furnace

Overview

The SST 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed offline. The system is used in both production and research environments for flux-free soldering, brazing, annealing, and glass sealing of components and packages for microelectronic applications.

SST 3130 Vacuum Pressure Furnace
graphite tooling

The 3130’s benefits include:

  • Precise control of soldering process profile
  • Consistent, highly reliable solder interface
  • Accurate control of thermal cycles
  • Ease of use and flexibility of operation

Processes

Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices.

Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.

Glass to Metal Sealing. Glass to metal sealing is performed at high temperatures to create hermetic seals for electrical feedthroughs and electronic components.. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.

Selected 3130 Options

  • Dry vacuum pump
  • Extended temperature range (1000°C)
  • Multiple zone temperature recording
  • Moisture level recording
  • Cooling water chiller/pump
  • CE Certification for European Market
  • Barcode scanner

Applications

  • Accelerometers
  • Atomic clocks
  • Automotive diodes
  • Automotive sensors
  • CPV solar cell modules
  • Fiber optic devices
  • Flip chips
  • GaN MMICs
  • Gated light arrays
  • Glass diodes
  • Glass-to-metal seals
  • Hearing aid amplifiers
  • Hermetic feed-throughs
  • High-accuracy gyroscopes
  • Implantable medical devices
  • Laser pump diodes
  • LED lamps and heaters
  • MEMS devices
  • Microwave packages

Download the Model 3130 Data Sheet

Download the Model 3130 Data Sheet

Graphite, ceramic, and metal fixtures are required for most microelectronic assembly processes. Learn more about tooling.
Find Out
Other Resources
5100 Vacuum Pressure Furnace Data Sheet
1200 Table Top Furnace Data Sheet
1500 Wafer Aligner Data Sheet
3150 High Vacuum Furnace Data Sheet