Tailless Ball Bump (MBD and MBH)
This ball bump application is a Palomar Technologies exclusive. The ball bumps are consistent and extremely versatile, found in a wide variety of parts and components. Ball bumping a wafer, single die or a substrate in a deep package for a flip chip process are all common applications.
The application of this bump requires control of MBD and MBH. Top height is not critical.
8000i Wire Bonder
Tailess Bump Mode
Wire = 1 mil (25.4 um) 99.99 Au
Substrate = Al pad
Temperature = 150 C
Mashed Ball Diameter = 115 um
Mashed Ball Height = 45 um
Throughput 10-12 BPS