Tailless Ball Bump (MBD and MBH)

This ball bump application is a Palomar Technologies exclusive. The ball bumps are consistent and extremely versatile, found in a wide variety of parts and components. Ball bumping a wafer, single die or a substrate in a deep package for a flip chip process are all common applications.

The application of this bump requires control of MBD and MBH. Top height is not critical.

Requirements:
8000i Wire Bonder
Tailess Bump Mode

Specifications:
Wire = 1 mil (25.4 um) 99.99 Au
Substrate = Al pad  
Temperature = 150 C  
Mashed Ball Diameter = 115 um  
Mashed Ball Height = 45 um  
Throughput 10-12 BPS