Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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Wire bonding is the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated circuit (IC) packages, RF microwave packages, and optoelectronic packages.


Gold wire bonding is the process by which gold wire is attached to two points in an assembly to form an interconnection or an electrically conductive path. Heat, ultrasonics, and force are all employed to form the attachment points for the gold wire.

Aluminum wire bonding is a process similar to gold wire bonding but with the key distinction that the surface does not need to be heated to 150C or even anything above room temperature.

Ball bumping is an important process in flip-chip applications as it provides the necessary interconnects between chip and substrate. Ball bumping can be performed at the assembly or wafer level.

Wedge bonding utilizes a wedge tool to form the stitches on both ends, without the use of a ball for the first bond. The bonds themselves a thin and wedge-shaped.