Ball Stud Bump
This ball bump application is an exclusive solution from Palomar Technologies. The ball bumps are consistent and extremely versatile, found in a wide variety of parts and components. Ball bumping a wafer, single die or a substrate in a deep package for a flip chip process are all common. Bump shape height and diameter can be controlled from 15 um tall to 300+ um tall in stack, as well as 35 um to 180+ um in diameter.