A Unified Solution for Microelectronics Packaging
With over 30 years in the business, Palomar Technologies and Royce Instruments both have a rich history of microelectronics equipment ...
Posted by Janine Powell on
With over 30 years in the business, Palomar Technologies and Royce Instruments both have a rich history of microelectronics equipment ...
Posted by Janine Powell on
At Palomar Technologies we often discuss the versatility of our equipment, as we have many uniquely adaptable and accurate approaches to a ...
Posted by Katie Finney on
In today’s busy world, figuring out how to maximize the hours in each day and save time have become high priorities. For instance, nobody ...
Posted by Janine Powell on
As microelectronics device designs evolve, so must handling and assembly processes. Die sorting is used to separate die of one wafer into ...
Posted by Janine Powell on
Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and ...
Posted by Janine Powell on
Wire bond interconnects have traditionally been considered "forward" bonded wires. Forward bonding refers to bonding from an integrated ...
Posted by Janine Powell on
It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...
Posted by Palomar Technologies MarCom Team on
As the semiconductor industry continues to develop new technologies, our weekly blog provides a lens into the viewpoints and expertise of ...
Posted by Palomar Technologies MarCom Team on
This week marks the Thanksgiving holiday, a time to celebrate autumn and give thanks with friends and family. Thanksgiving can also be a ...
Posted by Palomar Technologies MarCom Team on
In microelectronics production environments, bond testing can provide a means of evaluating bond quality and verifying bond consistency and ...
Posted by Janine Hueners on
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