Multi-Chip Modules & Stacked Die Assemblies
Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. Demand for further ...
Posted by Janine Powell on
Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. Demand for further ...
Posted by Janine Powell on
Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and ...
Posted by Palomar Technologies MarCom Team on
As microelectronics device designs evolve, so must handling and assembly processes. A common example is with the process of removing ...
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While 3D packaging and reliability was a reoccurring topic throughout the ECTC 2012 exhibit hall conversations, traditional 2D packaging ...
Posted by Palomar Technologies MarCom Team on
In anticipation of the market’s growing demand for MEMS products, a high-volume, high-yield manufacturing solution is the answer: Design ...
Posted by Palomar Technologies MarCom Team on
With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital ...
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MEPTEC MEMS, held this year in the heart of San Jose, CA, is traditionally a niche conference with a small exhibit show floor. This ...
Posted by Palomar Technologies MarCom Team on
July 13th - The DAY We are now only days away from Semicon West 2010, which opens at 10 AM on Tuesday, July 13th at the Moscone Center in ...
Posted by Palomar Technologies MarCom Team on
For today's MEMS manufacturer, low volume and high complexity are no longer subject to only manual packaging processes. Automation is here, ...
Posted by Palomar Technologies MarCom Team on
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