Microelectronic Mechanical Systems, or MEMS, technology is everywhere we look. The biotech, medical device, communications, and inertial sensing industries are increasingly using MEMS devices as miniaturization allows new synergies. Micro-displays, ink jet print heads, IR detectors, blood pressure sensors, and accelerometers are a few of the MEMS devices being used today, and it is inevitable that new applications will emerge. Some applications require MEMS devices to be packaged in a high vacuum environment. This means that the package is sealed under vacuum level below 10-06 torr.Read More
Tags: MEMS packaging
Sometimes we get requests from customers or potential customers needing a bonder right away. Of course, we try to do everything we can to accommodate the request. However, these systems are fairly complex to build, ship, and install. So what can be done?
One solution is to utilize our Assembly Services to get an organization into production on schedule, and then make a smooth transition to an internal production solution.
A possible scenario: You get an order from a customer, either external or internal, that requires you to be in production within a couple of months. However, it is something you have never built before, and involves processes that you have not utilized before. For this example, let’s say your customer is handing you a part build that requires gold/tin eutectic reflow and high-accuracy die placement. It is then connected to the package with gold ribbon. You are a microelectronics assembly house, but all of the systems you presently have are not capable to perform these particular processes. The customer has come to you because you built the previous version using epoxy die attach and ball bonds. The customer also needs to have the prototypes within a month, needs to be in low-volume production in 2 months, and mid- to high-volume in 4 months.Read More
Tags: Assembly Services
In many bonding applications, whether for die attach or wire bond, a successful bond can depend greatly on the method by which the parts are heated. Surface preparation and clamping are also critical, but in most applications a heater stage can be the unsung hero of the bond. In most wire bonding and wedge bonding processes for instance, the controlled application of heat is a critical component to the strength of a bond. To achieve a successful weld, a bonder must reach a critical threshold of energy input during the bonding process, which is typically done by combining ultrasonic energy from the tool and thermal energy from the stage. In eutectic die attach, there is a need to rapidly heat the part to achieve a bond, and then quickly cool the part down.Read More
Palomar Technologies modern bonding systems have a multi-decade history, with system software that has been continuously improved upon in large and small ways over the years. Other than improving reliability and stability, the software has mostly been improved and expanded by the addition of various features.Read More
Did you know that Palomar Technologies has thousands of systems installed worldwide and serviced directly by Palomar? Take a look into our office in Erlangen, Germany, where the Nuremberg International Airport is only a 10 minute drive away!Read More
Palomar Technologies has exhibited at two large Optoelectronic Technical Conferences in the last 2 months. SPIE Photonics West was held in San Francisco at the Moscone Center, and OFC (Optical Fiber Communication Conference and Exhibition) was held at the Los Angeles Convention Center. They each had a unique presence, but both had plenty of optoelectronic modules and sensors. Devices operating at up to 400Gb/s were being presented, and many were built on Palomar’s fine line of die bonders and wire bonders. There is a big push for low-power, high-speed modules of all types.Read More
Whether you are placing components for die attach or creating wire bonds (ball or wedge), a good quality connection requires that the substrate surfaces be held firmly in place. Particularly for wire bonding, if the substrate is allowed to move at all, the wire will most likely fail to bond or will be poorly attached. There are many ways to clamp parts, but the methods fall into one of two categories: vacuum clamping or mechanical clamping. Vacuum clamping is typically done using the bottom surface of the part (the side opposite the bond surface) and mechanical clamping is typically done by pushing down on the top (bond-side) surface. Both methods have advantages and disadvantages, and there are several points to consider when deciding which method is best to use for a particular application.Read More
Palomar has successfully worked with the global contract manufacturer Fabrinet over the last several years, working with our mutual customers to provide equipment and developed processes to successfully transition into manufactured goods. Many of these products started as prototypes in Palomar Technologies' Assembly Services department where the designs were validated for functionality. These were then further refined through pilot builds to include DFM (designed for manufacturability) changes. We learn much about a product when we build the first ten; we learn much more when we build the next 100 to 1,000 pieces. This is the time that we start understanding how to tweak the design and processes to make it easier, quicker and cheaper to produce.Read More
SST Vacuum Reflow Systems designs and builds systems and processes that achieve low to void-free seals for die attach component parts. However, the choice of materials is critical in achieving the most positive results by allowing good wettability, thus creating a good solder joint. Void-free solder joints mean improved thermal performance and high reliability (e.g. mechanical strength) of the device package.Read More