[For the English version of this blog, click here.]Read More
Last year, I wrote a blog about general EFO theory. This edition will focus on the history of the “flame-off” and a few more advanced topics. But first, let’s discuss the evolution of the flame-off system that evolved into electronic flame-off systems that wire (ball) bonders use today.Read More
“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ring?”
High levels of voids in the package seal ring may cause leak failures, which in turn can decrease the reliability and performance of your device. It may result in a short device lifetime and /or premature failure, or may cause some unforeseen damage to the end use product. For the best product performance and longevity, a void free seal is highly desirable.Read More
Microelectronic Mechanical Systems, or MEMS, technology is everywhere we look. The biotech, medical device, communications, and inertial sensing industries are increasingly using MEMS devices as miniaturization allows new synergies. Micro-displays, ink jet print heads, IR detectors, blood pressure sensors, and accelerometers are a few of the MEMS devices being used today, and it is inevitable that new applications will emerge. Some applications require MEMS devices to be packaged in a high vacuum environment. This means that the package is sealed under vacuum level below 10-06 torr.Read More
Tags: MEMS packaging
Sometimes we get requests from customers or potential customers needing a bonder right away. Of course, we try to do everything we can to accommodate the request. However, these systems are fairly complex to build, ship, and install. So what can be done?
One solution is to utilize our Assembly Services to get an organization into production on schedule, and then make a smooth transition to an internal production solution.
A possible scenario: You get an order from a customer, either external or internal, that requires you to be in production within a couple of months. However, it is something you have never built before, and involves processes that you have not utilized before. For this example, let’s say your customer is handing you a part build that requires gold/tin eutectic reflow and high-accuracy die placement. It is then connected to the package with gold ribbon. You are a microelectronics assembly house, but all of the systems you presently have are not capable to perform these particular processes. The customer has come to you because you built the previous version using epoxy die attach and ball bonds. The customer also needs to have the prototypes within a month, needs to be in low-volume production in 2 months, and mid- to high-volume in 4 months.Read More
Tags: Assembly Services
In many bonding applications, whether for die attach or wire bond, a successful bond can depend greatly on the method by which the parts are heated. Surface preparation and clamping are also critical, but in most applications a heater stage can be the unsung hero of the bond. In most wire bonding and wedge bonding processes for instance, the controlled application of heat is a critical component to the strength of a bond. To achieve a successful weld, a bonder must reach a critical threshold of energy input during the bonding process, which is typically done by combining ultrasonic energy from the tool and thermal energy from the stage. In eutectic die attach, there is a need to rapidly heat the part to achieve a bond, and then quickly cool the part down.Read More
Palomar Technologies modern bonding systems have a multi-decade history, with system software that has been continuously improved upon in large and small ways over the years. Other than improving reliability and stability, the software has mostly been improved and expanded by the addition of various features.Read More
Did you know that Palomar Technologies has thousands of systems installed worldwide and serviced directly by Palomar? Take a look into our office in Erlangen, Germany, where the Nuremberg International Airport is only a 10 minute drive away!Read More
Palomar Technologies has exhibited at two large Optoelectronic Technical Conferences in the last 2 months. SPIE Photonics West was held in San Francisco at the Moscone Center, and OFC (Optical Fiber Communication Conference and Exhibition) was held at the Los Angeles Convention Center. They each had a unique presence, but both had plenty of optoelectronic modules and sensors. Devices operating at up to 400Gb/s were being presented, and many were built on Palomar’s fine line of die bonders and wire bonders. There is a big push for low-power, high-speed modules of all types.Read More