Gold ball bumping is primarily used to make interconnects for flip chip bonded die. This process involves placing a single bump (or stacked bumps) on each interconnect location on a die. Palomar Technologies’ standard process makes a bump where the top height is about 60% of the bump diameter. The bump shape could best be described as a flattened “Hershey Kiss”. This shape works very well for thermosonic flip chip attach processing. The smaller top diameter is about the diameter of the wire used and is much more easily deformed during the attach process than a flat “pancake” bump would be. This allows for looser top height variations than would be required for a flat bump.Read More
The market dedicated to optoelectronic packaging with active optical cables and/or optical transceivers is an important one in which Palomar Technologies focuses. In fact, some of the most challenging photonic assemblies produced today are manufactured by Palomar. In a recent webinar presented by our Chief Technical Officer, Dan Evans discussed his technical paper diving deeper into this market: “Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies”.Read More
When it comes to microelectronics assembly, there are many challenges and solutions. One of the most critical differences between a manual or semi-automatic bonder and a fully automatic bonder is the ability to find and identify specific features, fiducials, or components on the parts. This is critical for accurate placement of die as well as wire bonds.Read More
Last year, I wrote a blog about general EFO theory. This edition will focus on the history of the “flame-off” and a few more advanced topics. But first, let’s discuss the evolution of the flame-off system that evolved into electronic flame-off systems that wire (ball) bonders use today.Read More
“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ring?”
High levels of voids in the package seal ring may cause leak failures, which in turn can decrease the reliability and performance of your device. It may result in a short device lifetime and /or premature failure, or may cause some unforeseen damage to the end use product. For the best product performance and longevity, a void free seal is highly desirable.Read More
Microelectronic Mechanical Systems, or MEMS, technology is everywhere we look. The biotech, medical device, communications, and inertial sensing industries are increasingly using MEMS devices as miniaturization allows new synergies. Micro-displays, ink jet print heads, IR detectors, blood pressure sensors, and accelerometers are a few of the MEMS devices being used today, and it is inevitable that new applications will emerge. Some applications require MEMS devices to be packaged in a high vacuum environment. This means that the package is sealed under vacuum level below 10-06 torr.Read More
Tags: MEMS packaging
Sometimes we get requests from customers or potential customers needing a bonder right away. Of course, we try to do everything we can to accommodate the request. However, these systems are fairly complex to build, ship, and install. So what can be done?
One solution is to utilize our Assembly Services to get an organization into production on schedule, and then make a smooth transition to an internal production solution.
A possible scenario: You get an order from a customer, either external or internal, that requires you to be in production within a couple of months. However, it is something you have never built before, and involves processes that you have not utilized before. For this example, let’s say your customer is handing you a part build that requires gold/tin eutectic reflow and high-accuracy die placement. It is then connected to the package with gold ribbon. You are a microelectronics assembly house, but all of the systems you presently have are not capable to perform these particular processes. The customer has come to you because you built the previous version using epoxy die attach and ball bonds. The customer also needs to have the prototypes within a month, needs to be in low-volume production in 2 months, and mid- to high-volume in 4 months.Read More
Tags: Assembly Services