Capabilities for Gold Ball Bumping Die

Posted by Janine Powell on Tue, Sep 12, 2017 @ 06:09 AM

Gold ball bumping is primarily used to make interconnects for flip chip bonded die. This process involves placing a single bump (or stacked bumps) on each interconnect location on a die. Palomar Technologies’ standard process makes a bump where the top height is about 60% of the bump diameter. The bump shape could best be described as a flattened “Hershey Kiss”. This shape works very well for thermosonic flip chip attach processing. The smaller top diameter is about the diameter of the wire used and is much more easily deformed during the attach process than a flat “pancake” bump would be. This allows for looser top height variations than would be required for a flat bump.

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Tags: gold ball bumping, Assembly Services

Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies

Posted by Janine Powell on Tue, Aug 29, 2017 @ 06:08 AM

The market dedicated to optoelectronic packaging with active optical cables and/or optical transceivers is an important one in which Palomar Technologies focuses. In fact, some of the most challenging photonic assemblies produced today are manufactured by Palomar. In a recent webinar presented by our Chief Technical Officer, Dan Evans discussed his technical paper diving deeper into this market: “Active Optical Cable Transceiver Packaging Trends and Die Bonding Case Studies”.

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Tags: active optical cables, VCSELs

Consequences of High Voids in the Package Seal Ring (封装密封圈中高空隙的后果)

Posted by Janine Powell on Tue, Aug 22, 2017 @ 06:08 AM

[For the English version, click here.]

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Tags: SST Vacuum Reflow Systems

Automatic Systems Require Superior Vision

Posted by Janine Powell on Tue, Aug 01, 2017 @ 06:08 AM

When it comes to microelectronics assembly, there are many challenges and solutions. One of the most critical differences between a manual or semi-automatic bonder and a fully automatic bonder is the ability to find and identify specific features, fiducials, or components on the parts. This is critical for accurate placement of die as well as wire bonds.

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Tags: VisionPilot, Vision System

Benefits of Reverse Wire Bonding & Stand-Off Stitch (Les avantages du câblage inverse et du stitch sur bump)

Posted by Janine Powell on Tue, Jul 18, 2017 @ 06:07 AM

[For the English version of this blog, click here.]

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Tags: chain bonding, wire bonding, stand-off stitch

History of Ball Bonding Flame-Off and Advanced Concepts

Posted by Janine Powell on Wed, Jul 05, 2017 @ 06:07 AM

Last year, I wrote a blog about general EFO theory.  This edition will focus on the history of the “flame-off” and a few more advanced topics.  But first, let’s discuss the evolution of the flame-off system that evolved into electronic flame-off systems that wire (ball) bonders use today.

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Tags: stand-off stitch, EFO

Consequences of High Voids in the Package Seal Ring

Posted by Katie Finney on Wed, Jun 21, 2017 @ 06:06 AM

“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ring?”

High levels of voids in the package seal ring may cause leak failures, which in turn can decrease the reliability and performance of your device. It may result in a short device lifetime and /or premature failure, or may cause some unforeseen damage to the end use product. For the best product performance and longevity, a void free seal is highly desirable.

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Tags: SST Vacuum Reflow Systems

Why or When One Should Use a Vacuum/Pressure Reflow Oven System as Opposed to Other Packaging Technology Systems (何时或何故以真空/压力回流炉系统取代其他封装技术系统)

Posted by Janine Powell on Tue, May 30, 2017 @ 06:05 AM

[View the blog in English here.]

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Tags: SST Vacuum Reflow Systems

High Vacuum MEMS Sealing Technology

Posted by Janine Powell on Tue, May 23, 2017 @ 06:05 AM

Microelectronic Mechanical Systems, or MEMS, technology is everywhere we look.  The biotech, medical device, communications, and inertial sensing industries are increasingly using MEMS devices as miniaturization allows new synergies. Micro-displays, ink jet print heads, IR detectors, blood pressure sensors, and accelerometers are a few of the MEMS devices being used today, and it is inevitable that new applications will emerge. Some applications require MEMS devices to be packaged in a high vacuum environment. This means that the package is sealed under vacuum level below 10-06 torr. 

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Tags: MEMS packaging

Immediate Production Required: Need to Build Parts Soon?

Posted by Janine Powell on Tue, May 09, 2017 @ 06:05 AM

Sometimes we get requests from customers or potential customers needing a bonder right away. Of course, we try to do everything we can to accommodate the request. However, these systems are fairly complex to build, ship, and install. So what can be done?

One solution is to utilize our Assembly Services to get an organization into production on schedule, and then make a smooth transition to an internal production solution.

A possible scenario: You get an order from a customer, either external or internal, that requires you to be in production within a couple of months. However, it is something you have never built before, and involves processes that you have not utilized before. For this example, let’s say your customer is handing you a part build that requires gold/tin eutectic reflow and high-accuracy die placement. It is then connected to the package with gold ribbon. You are a microelectronics assembly house, but all of the systems you presently have are not capable to perform these particular processes. The customer has come to you because you built the previous version using epoxy die attach and ball bonds. The customer also needs to have the prototypes within a month, needs to be in low-volume production in 2 months, and mid- to high-volume in 4 months.

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Tags: Assembly Services