Benefits of Reverse Wire Bonding & Stand-Off Stitch (Les avantages du câblage inverse et du stitch sur bump)

Posted by Janine Powell on Tue, Jul 18, 2017 @ 06:07 AM

[For the English version of this blog, click here.]

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Tags: chain bonding, wire bonding, stand-off stitch

History of Ball Bonding Flame-Off and Advanced Concepts

Posted by Janine Powell on Wed, Jul 05, 2017 @ 06:07 AM

Last year, I wrote a blog about general EFO theory.  This edition will focus on the history of the “flame-off” and a few more advanced topics.  But first, let’s discuss the evolution of the flame-off system that evolved into electronic flame-off systems that wire (ball) bonders use today.

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Tags: stand-off stitch, EFO

Consequences of High Voids in the Package Seal Ring

Posted by Katie Finney on Wed, Jun 21, 2017 @ 06:06 AM

“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ring?”

High levels of voids in the package seal ring may cause leak failures, which in turn can decrease the reliability and performance of your device. It may result in a short device lifetime and /or premature failure, or may cause some unforeseen damage to the end use product. For the best product performance and longevity, a void free seal is highly desirable.

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Tags: SST Vacuum Reflow Systems

Why or When One Should Use a Vacuum/Pressure Reflow Oven System as Opposed to Other Packaging Technology Systems (何时或何故以真空/压力回流炉系统取代其他封装技术系统)

Posted by Janine Powell on Tue, May 30, 2017 @ 06:05 AM

[View the blog in English here.]

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Tags: SST Vacuum Reflow Systems

High Vacuum MEMS Sealing Technology

Posted by Janine Powell on Tue, May 23, 2017 @ 06:05 AM

Microelectronic Mechanical Systems, or MEMS, technology is everywhere we look.  The biotech, medical device, communications, and inertial sensing industries are increasingly using MEMS devices as miniaturization allows new synergies. Micro-displays, ink jet print heads, IR detectors, blood pressure sensors, and accelerometers are a few of the MEMS devices being used today, and it is inevitable that new applications will emerge. Some applications require MEMS devices to be packaged in a high vacuum environment. This means that the package is sealed under vacuum level below 10-06 torr. 

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Tags: MEMS packaging

Immediate Production Required: Need to Build Parts Soon?

Posted by Janine Powell on Tue, May 09, 2017 @ 06:05 AM

Sometimes we get requests from customers or potential customers needing a bonder right away. Of course, we try to do everything we can to accommodate the request. However, these systems are fairly complex to build, ship, and install. So what can be done?

One solution is to utilize our Assembly Services to get an organization into production on schedule, and then make a smooth transition to an internal production solution.

A possible scenario: You get an order from a customer, either external or internal, that requires you to be in production within a couple of months. However, it is something you have never built before, and involves processes that you have not utilized before. For this example, let’s say your customer is handing you a part build that requires gold/tin eutectic reflow and high-accuracy die placement. It is then connected to the package with gold ribbon. You are a microelectronics assembly house, but all of the systems you presently have are not capable to perform these particular processes. The customer has come to you because you built the previous version using epoxy die attach and ball bonds. The customer also needs to have the prototypes within a month, needs to be in low-volume production in 2 months, and mid- to high-volume in 4 months.

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Tags: Assembly Services

Achieving an Advanced Degree: Pulsed Heat & Steady State Heater Stages

Posted by Janine Powell on Tue, May 02, 2017 @ 06:05 AM

In many bonding applications, whether for die attach or wire bond, a successful bond can depend greatly on the method by which the parts are heated. Surface preparation and clamping are also critical, but in most applications a heater stage can be the unsung hero of the bond. In most wire bonding and wedge bonding processes for instance, the controlled application of heat is a critical component to the strength of a bond. To achieve a successful weld, a bonder must reach a critical threshold of energy input during the bonding process, which is typically done by combining ultrasonic energy from the tool and thermal energy from the stage. In eutectic die attach, there is a need to rapidly heat the part to achieve a bond, and then quickly cool the part down.

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Tags: Pulsed Heat System (PHS), Steady Heater Stage (SHS)

Software: Big Feature, Small Feature, and More Features on the Way

Posted by Janine Powell on Tue, Apr 25, 2017 @ 06:04 AM

Palomar Technologies modern bonding systems have a multi-decade history, with system software that has been continuously improved upon in large and small ways over the years. Other than improving reliability and stability, the software has mostly been improved and expanded by the addition of various features.

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Tags: i2Gi, EFO, Software Enhancements

Palomar Technologies GmbH At-A-Glance

Posted by Janine Powell on Tue, Apr 18, 2017 @ 05:04 AM

Did you know that Palomar Technologies has thousands of systems installed worldwide and serviced directly by Palomar? Take a look into our office in Erlangen, Germany, where the Nuremberg International Airport is only a 10 minute drive away!

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Tags: Palomar Technologies GmbH

Optoelectronics Drive Advanced Packaging

Posted by Janine Powell on Mon, Apr 10, 2017 @ 22:04 PM

Palomar Technologies has exhibited at two large Optoelectronic Technical Conferences in the last 2 months.  SPIE Photonics West was held in San Francisco at the Moscone Center, and OFC (Optical Fiber Communication Conference and Exhibition) was held at the Los Angeles Convention Center.  They each had a unique presence, but both had plenty of optoelectronic modules and sensors.  Devices operating at up to 400Gb/s were being presented, and many were built on Palomar’s fine line of die bonders and wire bonders.  There is a big push for low-power, high-speed modules of all types.

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Tags: optoelectronic, ribbon bonding, Pulsed Heat System (PHS)