PTI Blog

[For the English version, click here.] В начале 80-х годов компания Palomar/Hughes начала разработку и производство Клин-Бондеров для аэрокосмической и оборонной промышленностей. Позже подобные устройства были использованы не только в военной
Posted by Janine Powell on Tue, Nov 14, 2017 @ 02:03 PM
The relentless increase in data processing requirements, network/cloud services, computing and web bandwidth advances, and soon-to-be-seen products like automated/autonomous vehicles forces automation and those providers to remain on their toes. 
Posted by Janine Powell on Tue, Nov 07, 2017 @ 02:13 PM
Standard bonding machine pattern recognition vision systems (auto correlation based) today determine their location based on a “pixel to pixel” matching system. Standard bonding vision systems look for similarities based on the pixel grid of the
Posted by Janine Powell on Tue, Oct 31, 2017 @ 01:13 PM
The proliferation of mobile devices, IP traffic, video-on-demand mobile and home, and Internet of Things continues to drive an exponential grow in data bandwidth. Meeting the data demand requires continuous improvements in bandwidth and capacity for
Posted by Janine Powell on Wed, Oct 25, 2017 @ 05:49 PM
The Palomar Technologies 8000i Wire Bonder/Ball (Stud) Bumper and 9000 Wedge Bonder both have a good selection of wire bonding “loop modes” to accommodate various process situations and achieve various wire loop profiles. On Palomar wire bonders,
Posted by Janine Powell on Tue, Sep 26, 2017 @ 02:05 PM
Gold ball bumping is primarily used to make interconnects for flip chip bonded die. This process involves placing a single bump (or stacked bumps) on each interconnect location on a die. Palomar Technologies’ standard process makes a bump where the
Posted by Janine Powell on Tue, Sep 12, 2017 @ 01:13 PM
The market dedicated to optoelectronic packaging with active optical cables and/or optical transceivers is an important one in which Palomar Technologies focuses. In fact, some of the most challenging photonic assemblies produced today are
Posted by Janine Powell on Tue, Aug 29, 2017 @ 01:18 PM
[For the English version, click here.] “如果您正在生产高价值的密封元件,在封装密封环中产生高空隙的后果是什么?” 封装密封圈中高度的空隙可能会导致泄漏故障,从而降低元件的可靠性和性能。 这可能导致元件寿命减短或过早损坏,或者可能会对最终用途产品造成一些意外的损坏。 为了获得最佳的产品性能和使用寿命,无空隙的密封是必要的。 那么,我们如何以最大限度地减少密封圈的空隙? 首先,请记住,无密封的关键在于: 使用原材料的质量 预制品中的杂质 清洁组件
Posted by Janine Powell on Tue, Aug 22, 2017 @ 01:03 PM
When it comes to microelectronics assembly, there are many challenges and solutions. One of the most critical differences between a manual or semi-automatic bonder and a fully automatic bonder is the ability to find and identify specific features,
Posted by Janine Powell on Tue, Aug 01, 2017 @ 01:08 PM
[For the English version of this blog, click here.] Les interconnexions en câblage filaire dans l’électronique on traditionnellement été considérées comme « directes ».Le câblage « direct » signifiant que les connexions sont faîtes depuis le
Posted by Janine Powell on Tue, Jul 18, 2017 @ 01:03 PM