PTI Blog

The Microelectronics Packaging & Test Engineering Council (MEPTEC) began over 30 years ago, and provides a forum for semiconductor packaging and test professionals to learn and exchange ideas related to packaging, assembly, and test. Monthly
Posted by Janine Powell on Tue, Jan 16, 2018 @ 02:07 PM
While we are now in what is called the "information age", it is easy to lose sight of the foundation of this information age—namely the fundamental engines of information flow—the complex devices that transfer, transmit and amplify data flow across
Posted by Janine Powell on Tue, Jan 02, 2018 @ 02:03 PM
Often customers are wrestling with the question of which option makes more sense in their given business environment: a manual system, independent automated work cells, or an entire line of automation? There are many factors to consider, but one of
Posted by Janine Powell on Tue, Nov 28, 2017 @ 02:10 PM
[For the English version, click here.] В начале 80-х годов компания Palomar/Hughes начала разработку и производство Клин-Бондеров для аэрокосмической и оборонной промышленностей. Позже подобные устройства были использованы не только в военной
Posted by Janine Powell on Tue, Nov 14, 2017 @ 02:03 PM
The relentless increase in data processing requirements, network/cloud services, computing and web bandwidth advances, and soon-to-be-seen products like automated/autonomous vehicles forces automation and those providers to remain on their toes. 
Posted by Janine Powell on Tue, Nov 07, 2017 @ 02:13 PM
Standard bonding machine pattern recognition vision systems (auto correlation based) today determine their location based on a “pixel to pixel” matching system. Standard bonding vision systems look for similarities based on the pixel grid of the
Posted by Janine Powell on Tue, Oct 31, 2017 @ 01:13 PM
The proliferation of mobile devices, IP traffic, video-on-demand mobile and home, and Internet of Things continues to drive an exponential grow in data bandwidth. Meeting the data demand requires continuous improvements in bandwidth and capacity for
Posted by Janine Powell on Wed, Oct 25, 2017 @ 05:49 PM
The Palomar Technologies 8000i Wire Bonder/Ball (Stud) Bumper and 9000 Wedge Bonder both have a good selection of wire bonding “loop modes” to accommodate various process situations and achieve various wire loop profiles. On Palomar wire bonders,
Posted by Janine Powell on Tue, Sep 26, 2017 @ 02:05 PM
Gold ball bumping is primarily used to make interconnects for flip chip bonded die. This process involves placing a single bump (or stacked bumps) on each interconnect location on a die. Palomar Technologies’ standard process makes a bump where the
Posted by Janine Powell on Tue, Sep 12, 2017 @ 01:13 PM
The market dedicated to optoelectronic packaging with active optical cables and/or optical transceivers is an important one in which Palomar Technologies focuses. In fact, some of the most challenging photonic assemblies produced today are
Posted by Janine Powell on Tue, Aug 29, 2017 @ 01:18 PM