Where is the Future of the Semiconductor Industry Headed?

Posted by Janine Powell on Tue, Feb 14, 2017 @ 06:02 AM

The semiconductor industry saw the highest-ever annual sales in 2016, totaling $338.9 billion, according to the Semiconductor Industry Association. An article in Nasdaq.com states that “while the industry as a whole may appear sluggish, there are solid opportunities waiting to be picked”, providing hope and optimism within the industry. John Nueffer, the president and CEO of the Semiconductor Industry Association, stated: “Market growth was driven by macroeconomic factors, industry trends, and the ever increasing amount of semiconductor technology in devices the world depends on for working, communicating, manufacturing, treating illness, and countless other applications”.

Read More

Tags: semiconductor industry, Internet of Things (IoT)

Manual Part Presentation for Gold Ball Bond/Bump

Posted by Janine Powell on Tue, Jan 31, 2017 @ 06:01 AM

There are many different directions to go in when it comes to part presentation stages—from that simple part built by the thousands yearly, to complex parts with different sizes and shapes. When making a presentation stage decision, start with the product mix and the parts’ typical requirements. For high-volume automated lines, we can put together integrated lines that are designed for a specific part, or a handful of products that can be handled with minimal tooling changeovers. Additionally, there is the question of manual presentation methods. This can allow the customer to be prepared for almost any part that may come in the future.

Read More

Tags: gold ball bumping, customized packaging solutions, 8000i Wire Bonder

Selecting the Right Solder Alloy for Your Application

Posted by Janine Powell on Tue, Jan 24, 2017 @ 06:01 AM

Selecting the right solder alloy for your application is crucial to the success of the project.  If the right solder alloy is not selected and plating requirements are not defined, the selected process may not be capable of producing solderable deposits. Incomplete plating requirements often result in excessive rework and scrap.

With so many different alloy compositions of solder available, choosing the right alloy could be quite challenging. 

The best approach is to consider:

1) What is the maximum temperature that the device(s) can be exposed to without damaging the device or device performance?
2) Consider that some alloys really need from 25°C to in some cases 100°C hotter (above the melting point) to flow well and wet the mating surfaces.  Can the device tolerate this elevated solder temperature?
3) What are the die and substrate metallizations?
4) Do you have the correct metallizations for that selected solder alloy?
5) Is there a good history of successful good wetting and flow for that alloy?
6) Flux Less or with Flux?
7) Is there a lead free requirement?

For flux-less die attach and lid seal the workhorse solder alloy used by the majority of SST Vacuum Reflow Systems' customers is 80Au20Sn with a melting point of 278°C.  This alloy can be used as received without the need for any surface oxide removal as compared to lead, tin, or indium based solder alloys where the native metal oxides would interfere with solder wetting and would require acid etching just prior to loading for soldering.

Read More

Tags: SST Vacuum Reflow Systems, Void-free Die Attach

Gold Wire Bonding and the Rise of Copper Wire (Le Câblage en Fil d’or et l’émergence du Fil de Cuivre (Cu))

Posted by Janine Powell on Tue, Jan 17, 2017 @ 06:01 AM

[Read the English version of the blog here.]

Read More

Tags: gold ball bumping, Assembly Services, 8000i Wire Bonder, gold wire, copper wire

Fluxless Formic Acid Technology to Reduce Metal Oxides

Posted by Janine Powell on Tue, Jan 10, 2017 @ 06:01 AM

Liquid flux (acidic base or inorganic based) has traditionally been the primary solution to allow soldering of metal parts with surface oxides for high quality wetting of the solder to these metals. However, there are significant flaws or issues with the use of flux in soldering.

Issue #1: Flux Residue. Flux residue is known to react with water vapor to create an acidic solution surface that will react with and corrode metal connections. This results in possible metal shorts and opens and reduces reliability and long term life of the electrical connection.

Issue #2: Voiding. Flux, whether in liquid form or as a constituent of solder paste, has liquid components that vaporize or outgas during the soldering reflow high temperature, resulting in trapped voids or bubbles in the solder joint. These gas voids can displace heat and electrical paths which can cause non-uniform patchy heat transfer and can concentrate heat in localized areas, resulting in stress and possible cracks.   

Read More

Tags: SST Vacuum Reflow Systems, Void-free Die Attach

Custom Tooling for Wire Bonding

Posted by Janine Powell on Tue, Jan 03, 2017 @ 06:01 AM

Wire bonding is a well-known process that has been around for many decades. It was all performed manually from the mid-1950s to the late 1970s.  In the very early 1980s, semi-automatic and fully automatic wire bonders started to become available.  Hughes Aircraft Company’s equipment group in Carlsbad launched the venerable Model 2460 in March of 1980.  As of about 5 years ago, the very first unit was still in production in upstate New York, being used for rework wire bonding.  That unit has seen some battles! From the mid-1950s until today, one of the fundamental requirements for good wire bonding results has always been part tooling and clamping.

Read More

Tags: wedge bonding, wire bonding, customized packaging solutions

Happy New Year from Palomar Technologies' CEO!

Posted by Janine Powell on Wed, Dec 28, 2016 @ 06:12 AM

Again, there is much to be thankful for as we close out 2016.  Certainly microelectronics remains one of the key components of our world today, having dramatically changed lives.  The average consumer has no concept of what is inside an electronic device like a cell phone or satellite, and certainly has no understanding of the complex process of building it.  We consider ourselves fortunate at Palomar to be in the core of high-end microelectronics, providing the advanced automation and processes to connect the power and intelligence of the microchip to the outside world. Over the last twenty-plus years, the rate of progress across the entire field of microelectronics has been exponential and is showing no sign of letting up.  An increasingly connected and complex world drives a greater need for advanced electronic packaging and represents an exciting future for Palomar Technologies.

Read More

Two Processes for Eutectic Die Bonding

Posted by Janine Powell on Tue, Dec 13, 2016 @ 06:12 AM

Assembly Services has two separate processes available for eutectic bonding available in our lab. We can utilize our 3880 or 6500 Die Bonder with a Pulsed Heat System, or our SST 5100 Vacuum Reflow Oven. Each process has its advantages and specific uses.

Read More

Tags: eutectic die attach, controlling temperature, force/scrub method, Void-free Die Attach

Improved Thermocouple Contact in Graphite Boat (改善3130型号热电偶在石墨舟的接触)

Posted by Janine Powell on Tue, Dec 06, 2016 @ 06:12 AM

[Read the English version of the blog here.]

Read More

Tags: Graphite, SST Vacuum Reflow Systems

New Automated Production Lines and Expanded Service

Posted by Janine Powell on Tue, Nov 29, 2016 @ 06:11 AM

As you know, the microelectronics industry is always growing and changing. We grow and change along with it, staying ahead of the next technological advancements. As we expand our customer base, we expand our customer service reach to ensure we provide support wherever it is needed.

Read More

Tags: international customers, field services support, inline assembly