Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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Die bonding (often referred to as die attach) is the process of attaching a die/chip to a substrate or package. Die attach is accomplished by using one of the following processes:


Epoxy die bonding, sometimes referred to as epoxy attach, or even thermal cure epoxy attach is one of the most common die bonding methods in the industry due to its price point and speed.

Palomar Technologies specializes in automated, high-accuracy, large work die attach and vacuum reflow solutions. Our expertise and capabilities include eutectic and epoxy die attach, micron-level pick-and-place, void-free die attach, and flip chip processes.

Solder paste die attach or reflow attach uses solder paste to attach SMT components.  It can be processed at the same speed as epoxy die attach, yet provides the high thermal conductivity needed for the components to function correctly.

Eutectic die bonding, sometimes known as eutectic die attach or fluxless eutectic solder attach, is a process that forms high thermally and electrically conductive bonds that are often needed for the densely packed circuits in today’s dies.
Silver sintering die bonding or sintering paste attach is unique from both solder and epoxies; it neither cures nor does it reflow. Silver sintered paste instead goes through a process akin to solid diffusion.
Thermocompression die bonding or attach uses no adhesives to join the die and the package. Instead, large amounts of heat and force are applied to the die to form a metallic bond with the substrate.