Die bonding (often referred to as die attach) is the process of attaching a die/chip to a substrate or package. Die attach is accomplished by using one of the following processes:
Epoxy die bonding, sometimes referred to as epoxy attach, or even thermal cure epoxy attach is one of the most common die bonding methods in the industry due to its price point and speed.
Solder paste die attach or reflow attach uses solder paste to attach SMT components. It can be processed at the same speed as epoxy die attach, yet provides the high thermal conductivity needed for the components to function correctly.