Carlsbad, CA – September 24, 2013 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced new product demos at IMAPS 2013. The 8000i Wire Bonder with Intelligent Interactive Graphical InterfaceTM (i2GiTM) will be showcased through live demonstrations in booth #511 on October 1-2 at the Rosen Centre Hotel in Orlando, FL.
Wire Bonding & Stud Bumping Technical Track
Dan Evans (Palomar Technologies Senior Scientist) and Lee Levine (Process Solutions Consulting) will co-chair the Wire Bonding and Stud Bumping technical track. This session track covers non-destructive testing challenges and methods of wires and bond pads, Pd-coated Cu wire process window optimization, Cu wedge bonding, Al and Ag based wires as alternatives to copper, plus hybrid wire bond capabilities. Evans and David Rasmussen (Palomar Technologies Assembly Services™ General Manager) will present “Multipurpose Wire Bonding - Bumps, Wires, Combination Interconnects, and Operation Efficiency” at 4:30 PM - 4:55 PM on Tuesday, October 1.
Test Drive New Wire Bonding Software at IMAPS 2013
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IMAPS 2013 attendees are able to test drive i2Gi (cleverly pronounced “iggy”) in booth #511 throughout the duration of the exhibit hall. i2Gi is implemented on the new 8000i Wire Bonder and is available as a Bonder Performance Upgrade (BPU) for existing 8000 Wire Bonders. |
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i2Gi offers the required management tools for modern wire bonding, from part design and development, to process validation, and finally to intuitive operations control to support automated complex microelectronics packaging and production. i2Gi enables wire bond programmers and operating technicians to work smarter, faster and with more control. Bonder program developers and operators experience real-time bonding and part quality validation. |
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The new 8000i Wire Bonder comes equipped with i2Gi technology. The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices. |
The 8000i Wire Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions, such as fully automated hybrid production lines. The 8000i Wire Bonder is designed for scalability in automated factory production of complex/high-mix microelectronic device packaging.
See i2Gi in Action
About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
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Contact
Jessica Sylvester
Marketing Communications Manager
Palomar Technologies, Inc.
jsylvester@bonders.com | +1 760-931-3681