Downey, CA—September 5, 2017—SST Vacuum Reflow Systems and Palomar Technologies today announced they will be exhibiting assembly and packaging systems at the China International Optoelectronic Exposition (CIOE). The show will be held at the Shenzhen Convention & Exposition Center on September 6-9, 2017; Palomar and SST will be exhibiting in Hall 2, Booth 2L55.
Alex Voronel, Director of Global Sales at SST Vacuum Reflow Systems, will be presenting a technical paper during CIOE. The topic of the paper he will be presenting is “Modern Assembly Technology for Packaging IR Microbolometers”. Among the topics discussed in this paper is the need for many MEMS devices such as inertial sensors, micro-bolometers, RF devices and optical switches to be in a high vacuum or a precisely controlled inert gas atmosphere. Also, how the effect of hermeticity, gas permeation, surface desorption and hydrogen diffusion, selection of the getters and their integration into the device, and selection of the discrete ceramic packages will have an impact on the performance of the High Vacuum MEMS device. More information on this session (as well as other sessions on infrared technology) can be found here: https://www.i-micronews.com/component/content/article.html?id=9564-ir-imaging-forum-agenda-2.html.
The CIOE is the world’s largest optoelectronic event, which will be attended by over 50,000 optoelectronics professionals viewing over 3,200 brands. Topics cover the top industry segments including intelligent optical networks, bio-photonics, optical lens, camera modules, sapphire emerging applications, key technology of IR imaging, and laser processing.
Be sure to stop by Hall 2, Booth 2L55 to discuss your assembly and packaging challenges with us.
About Palomar Technologies
Palomar Technologies is the global leader of automated high-accuracy, large work area die attach and ball and wedge wire bonding equipment and precision contract assembly services. Customers utilize systems, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.
About SST Vacuum Reflow Systems
SST Vacuum Reflow Systems is widely recognized as an innovative leader in the development and application of microelectronic package assembly equipment and technology. For over fifty years, SST has provided flux-free and void-free soldering systems for high vacuum MEMS devices, power modules and wafer bonding to the global electronics industry. SST is a wholly owned subsidiary of Palomar Technologies. For more information, visit www.sstinternational.com.
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Media Contact
A.J. Wilson
Chief Marketing Officer
Palomar Technologies, Inc. and SST Vacuum Reflow Systems
awilson@bonders.com | +1 760.931.3722