Press Release

Palomar Technologies Presenting Latest in Bonding for Advanced Semiconductor, Optoelectronic and RF Packaging Requirements

Posted by Palomar Technologies MarCom Team on Thu, Oct 04, 2018 @ 08:18 PM

Carlsbad, CA – October 4, 2018 – Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, announced it will present two technical papers/case studies at the Wire Bonding Workshop and Exhibition on October 8, 2018 in conjunction with the iMAPS 51st Symposium on Microelectronics in Pasadena.

The two presentations showcase Palomar’s research into how the company can meet the needs for the growing demands for advanced devices that offer higher data capacity, faster speed, smaller designs and more sustainable solutions. 

Advanced Wedge Bonding Technologies

Dan Evans, CTO, Palomar Technologies

The explosive growth of global data traffic has resulted in a significant high demand for data bandwidth. As a result, optoelectronic and RF devices keep advancing towards much smaller module size and much higher module frequency. Wedge/ribbon bonding offers deep access, fine pitch and better high frequency performance compared with ball bonding; therefore, wedge/ribbon bonding suits well to support optoelectronic and RF packaging requirements. Driven by both advanced RF and optoelectronic system requirements as well as associated testing equipment, wedge/ribbon bonding not only refines its limit to bond fine wires/ribbons and be able to create specific geometric loop profile, but also makes great improvement on the pattern recognition algorithms to achieve better vision performance. This paper reports some of the latest advances in wedge/ribbon bonding processes at Palomar Technologies to better serve optoelectronic and RF packaging.

Au Planar Bumps for Flip Chip Bonding  

Trent Nash, Applications Engineer, Palomar Technologies

The semiconductor packaging industry continues a relentless pursuit to make smaller packages with a higher throughput. The industry demand for smaller components requires manufacturers to adapt by developing new processes. This presentation will explore the shrinking specifications of wire bonding requirements in regards to ball bump mashed ball diameter and top heights, and how to achieve them.

Upcoming Events

Palomar Technologies is exhibiting at the iMAPS 51st International Symposium on Microelectronics (Booth #503) in Pasadena, CA, USA from October 8-11, 2018. 

About Palomar Technologies
Palomar Technologies is a global leader of automated high-accuracy, large work area die attach and wire and wedge bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for microelectronic and photonic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit:


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