This virtual event, March 6 – 11, 2021, will highlight Palomar’s solutions for advanced photonics packaging. Learn about the Palomar 3880 Die Bonder, the new Palomar 8100 Wire Bonder and the new SST 8300 Automated Vacuum Pressure Soldering System.
Palomar's Product Marketing Manager, Kyle Schaefer, will be presenting a video product demo:
Demo Title: 3880 Die Bonder – Unparalleled flexibility for next generation photonic packaging
Description: Palomar Technologies’ 3880 Die Bonder provides the flexibility and versatility to handle the many challenges present in both the current and next generation of photonics packaging. Not only is the 3880 capable of a diverse range of processes from epoxy dispense, to UV snap cure, to eutectic die attach, but the equipment can also scale with production volume by having options optimized both for low volume process development and full scale high volume production. The 3880 offers software and hardware necessary for the traceability and process monitoring that is essential for optimal production yield.
Register for the event: https://spie.org/ExhibitorDetail?ExpoID=2062&ExhibitorID=49655&SSO=1.
Once registered, during the event you will be able to chat live with Palomar sales and technical representatives, or complete the form on this page and set up a meeting with us in advance.