Ball Bonding vs. Wedge Bonding

For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...

Posted by Janine Powell on June 24

productronica: 5 Fragen an Herr Josef Schmidl

[For the English version, click here.] productronica 2013 feiert sein 20 jähriges Jubiläum als die „internationale Leitmesse“ für ...

Posted by Janine Powell on November 12

Understanding the Relationship Between Semiconductors, SMT, and Microelectronics

Today’s mainstream electronics manufacturing consists mainly of semiconductor packages and surface mount technology processes. Together, ...

Posted by Janine Powell on August 20

Celebrate 43 years of SEMICON West

SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products ...

Posted by Janine Powell on August 13