The Frequently Asked Questions Mini Series: 3800 Die Bonder
This is the start of a mini series of blogs discussing frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the 9000 ...
Posted by Katie Finney on
This is the start of a mini series of blogs discussing frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the 9000 ...
Posted by Katie Finney on
For applications that have strict temperature parameters, eutectic die attachment is typically the best solution. Epoxies and other fluid ...
Posted by Janine Powell on
There was a lot of buzz last week surrounding Apple’s announcement regarding new product releases and enhancements. With the release of the ...
Posted by Janine Powell on
[For the English version, click here.] Il y a des myriades de différences entre la soudure eutectique ou le collage à l’époxy . Il existe ...
Posted by Janine Powell on
Eutectic bonding of Au-backed MMIC (Monolithic Microwave Integrated Circuits) power amplifiers presents a unique challenge due to the thin, ...
Posted by Janine Powell on
W – Wafer While the microelectronics industry is working hard to develop low-cost LED packaging methods—such as with thermally and ...
Posted by Janine Powell on
[For the English version, click here.] ...
Posted by Janine Powell on
In this series, we are exploring the ins and outs of LEDs. Last week, we began our LEDs series with “A - Attach process” and “B - Boule”. ...
Posted by Janine Powell on
Handlers are bonder options that can bring great value and efficiency to your assembly process. For example, on the 8000 Wire Bonder, ...
Posted by Janine Powell on
According to a recent Business Insider report, there are over 1.5 billion people in the world today using a smartphone, so it is safe to ...
Posted by Janine Powell on
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