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Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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PTI Blog

Manual to Automatic – Compensating for Process Variables

Posted by Janine Powell on Tue, May 03, 2016 @ 01:30 PM

We have the privilege and opportunity to work with customers who are ready to make the leap from a manual production environment to a fully automatic solution. Although initially the concept may seem straight-forward, often there can be a wide array of challenges that need to be addressed.

Manual Operator to Automatic System
One of the big differences is that you are removing the operator from the equation. Often the operators have years of experience and know-how to compensate for variances in the processes.  For example, this may include realigning parts to epoxy-daubing.pngcompensate for previous misalignments, or compensating on the next dot of epoxy when the previous dot was too large or small.  An example in wire bonding could be when increasing the bond time or force to compensate for changes in the bonding surfaces.  Whenever we hear the words, “then the operator tweaks this”, we have to ask ourselves:  is this something the automatic system can deal with?

In order to do this, the automatic system must be repeatable and accurate. However, even more importantly, it has to be able to compensate for variances in the parts or the process.  For example, the fully-automatic 8000i Wire Bonder and the 9000 Wedge Bonder have deformation monitoring capability that allows the system to monitor the bond deformation to insure the desired bond was achieved. They also have Adaptive Bond Deformation™ that allows the system to compensate for variances in the bond surface and adjust the bond parameters on-the-fly.  In regards to die bond, there are lots of tools available for compensation of process variables.  For example, our 3880 Die Bonder can place the next die relative to the previously placed die; in other cases using complex algorithms, it can place the die in a position based on the average position of multiple pre-placed die.

Manual to Automatic:  Components and Parts
Another challenge that often arises involves presenting the components and fixturing the parts from the manual systems to the automatic solution.  In many cases, due to our equipment’s large work areas, we can either use existing manual tooling or use our variety of custom stages to present multiple parts to the system. This reduces the need for loading/unloading or, with the use of automatic handling and feeding systems, can eliminate the need for operator interaction entirely.  There is also the challenge when the operator pours the parts out of a vial onto a work visionpilot_radarreferencing.pngsurface, and then uses tweezers or a vacuum pen to pick and place.  However, with the new VisionPilot® with Radar Referencing®, we only have to get the part in a singular location.  Using the example of a waffle pack, the 3880 can find the component, preform, and/or die in any orientation.  You also have the capability of auto-focus and, if required, can even flip the device over automatically or use a look-up camera.

In short, there are many tools on our automatic solutions that are designed to compensate for variances to the process that the operator in the manual setting addresses.

Download these resources for more information on automating your process: 

3880 Die Bonder
Data Sheet

3880 die bonder

8000i Wire Bonder
Data Sheet6500 Die Bonder Data Sheet

9000 Wedge Bonder
Data Sheet9000 Wedge Bonder data sheet

VisionPilot Data Sheet
VisionPilot Data Sheet

Guide to Automated Production Lines eBook

automated production lines

Buyer's Guide to Microelectronics Packaging Equipment 

Top Considerations When Purchasing A Bonder

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Dale Perry
Regional Account Manager, Eastern Americas

Palomar Technologies, Inc.