Technical Considerations of Lid Sealing versus Seam Sealing for Electronic Packages

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While lid sealing has been around for many years and is considered a legacy technology, it is helpful to revisit the topic and consider how lid sealing compares to seam sealing. By understanding the technology and its typical uses and within the context of individual package designs, the ability to determine which method to select improves the likelihood of success. The key factors to consider when choosing either technology are the thermal impact on the components that are being sealed inside the package, the hermeticity level (Hermetic – Non-Hermetic), and the production volume.

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Lid_Sealing VS_Seam_Sealing_Electronic_Packages_04282020


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