About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides packaging solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, Palomar now supports a wide range of industries including automotive, lasers, LEDs, medical & bio photonics, military/high reliability/MEMS, power semiconductors, RF/microwave/wireless, sensors and telecom/5G/Datacom. Select your industry to learn about Palomar’s solutions.

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Overview


Innovation Centers

Palomar® Technologies offers multiple locations with full-service OSAT laboratories which provide volume manufacturing, process development, package prototyping, assembly, test, and measurement for processes such as die attach, wire bonding, vacuum reflow, and more.

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Overview


Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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Overview


SCI Automation focuses on the design and manufacturing of integrated plasma (or vacuum) systems. These best-in-class systems are used around the world in vacuum and plasma applications where automation is required in vacuum, pressurized, or controlled atmosphere environments. This plasma automation includes batch load or full automation (material movement and tracking).

SCI’s product suite includes plasma cleaning and activation for the following applications and markets:

  • semiconductor applications
  • electronic applications
  • automotive applications
  • optoelectronic applications
  • hybrid applications
  • medical applications
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SCI data sheets
  • Integrated plasma or vacuum systems
  • Vacuum and plasma applications
  • Applications where automation is required in vacuum or pressurized or controlled atmosphere environments
  • Automation for material movement and tracking
  • Automated welding applications
  • Custom automation for the semiconductor, automotive, and related industries
  • Applications for die sorting and binning
  • LED on wafer with spectrophotometer measurements
  • Wafer scanning for defect control and mapping
Palomar Technologies' 8000i Wire Bonder and SCI’s QML-EX plasma cleaner work side by side to package and assemble high-yield, high-performing complex packages. Together, they provide complex ball bonding and plasma cleaning capability in a single inline solution. As both platforms are SMEMA-compatible, customers can enjoy a turnkey high-yield system.
8000i Wire Bonder and SCI’s QML-EX Plasma Cleaner