Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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Military, aerospace, and many high-reliability optoelectronics applications work with large complex hybrids. Hybrids are different from single chip applications; they are multi-chip, complex, and require sophisticated packaging equipment to execute assembly.
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MMICs, short for monolithic microwave integrated circuits, operate at microwave frequencies and perform functions like microwave mixing, power amplification, and high-frequency switching. MMIC products are important for electronic warfare, signals intelligence, and military communications.
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In a fundamental sense, a sensor is a device that can measure a physical quantity or converts it into a signal. Ultrasonic sensors, also called transistors when they send and receive, work like RADAR as they interpret radio or sound waves. In military, medical, or automotive industries, theses sensors can be used to detect the presence of a target or measure distance.
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Demand for further miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays will continue to grow. Multi-chip module (MCM) packaging is an important facet of modern electronic miniaturization and microelectronic systems. It’s designed for multiple integrated circuits to facilitate its use as a single package.
System on a chip (SoC) technology is designed for applications that require all components implemented at the chip level. This refers to integrating all components of an electronic system into a single integrated circuit or “chip.” This chip can contain a variety of signals, including digital, analog, mixed-signal, and often RF functions, and does it all one single chip. Applications include digital signal processors, embedded systems, video decoders, mobile phones, and portable media devices.
Radio frequency or RF packaging transfers signals while preserving bandwidth. RF packaging and assembly provides extremely accurate, high-yield microchip assembly solutions. Packaging needs at higher frequencies are being driven by the applications of personal communication, wireless local area networks, satellite communications, and automotive electronics.
A microbolometer is an uncooled detector in a thermal camera. It uses infrared radiation to change electrical resistance while maintaining its compactness and portability. Its capabilities are important in the thermal imaging technology used extensively in the military fields.
High accuracy gyroscopes are key components in modern aviation, space travel, and navigation. They use MEMS technology, which combines electronic circuitry with mechanical structures to produce different outcomes.
Night vision IR sensors work by utilizing a specific light sensor to detect infrared radiation. These are critical defense applications that permit high-resolution vision in near or total darkness.
A thermistor, which comes from the term “thermally sensitive resistors” is an accurate and inexpensive sensor to measure temperature. The aerospace market uses this extensively.

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