About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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A power module houses several power semiconductor devices. Power modules are usually soldered or sintered on a power electronic substrate that contains the power semiconductors, and provide thermal contact and electrical insulation when needed.
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Concentrator photovoltaics technology produces electricity from sunlight. It uses optics to focus the sun’s power on small yet highly efficient solar cells. These CPV solar cells also reduce the cost of solar equipment.
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Schottky diode modules, named after German physicist Walter H. Schottky, are also known as hot carrier diode modules. Formed by integrating semiconductor with a metal, Schottky diodes can be used in power supply and voltage clamping.
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A thyristor module is a solid-state semiconductor device that features four layers of alternating N and P-type materials. It functions as a bistable switch and can be used in different kinds of circuits: power-switching, oscillator, inverter, and relay-replacement.
Integrated circuits (IC) can be classified into analog, digital, and mixed signal—both analog and digital on the same chip. ICs were first packaged in ceramic flat packs, which were used by the military for their reliability and small size for many years. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. Power integrated circuits can handle high voltage, high current, or both.
A power transistor is commonly used in high-power amplifiers and power supplies. This is ideal for applications that require a lot of power, both current and voltage.

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