Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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The microwave market is characterized by lower volume and higher mix when compared to semiconductor packaging. This requires different levels of manual and automatic assembly process steps depending on product and manufacturing maturity. Varying die attach, wire bonding and vacuum reflow requirements are available for microwave applications.
stacked die
Die stacking, also known as chip stacking, is the process of mounting multiple chips on top of each other within a single semiconductor package. This packaging process, which saves precious space on a printed circuit board, results in better performance since shorter routing of interconnections between circuits leads to faster signal transmission.
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Microwave applications work with large complex hybrids. Hybrids are different from single chip applications: hybrids are multi-chip, complex and require sophisticated packaging equipment to execute assembly.
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All microwave systems, both transmitters and receivers, rely on oscillators to generate signals.
Fine pitch devices require proximity to other wires, diodes, or any other aspect of a device package. Fine pitch applications usually need a more sophisticated or capable wire bonder. Factors at work include tight control of bonding force, ultrasonic energy level, and the looping capability of the wire (reverse loops, long loops, short loops, low loops).
flip chip assembly
In flip chip assembly, the chips are mounted to a substrate, board, or carrier by flipping them over, so that the top side faces down and the pads align with the corresponding pads on the external circuit; solder is then flowed to complete the interconnect. Flip chip processes have gained popularity among manufacturers of cell phones and other small electronic devices.
System on a chip (SoC) technology is designed for applications that require all components implemented at the chip level. This refers to integrating all components of an electronic system into a single integrated circuit or “chip.” This chip can contain a variety of signals, including digital, analog, mixed-signal, and often RF functions, and does it all one single chip. Applications include digital signal processors, embedded systems, video decoders, mobile phones, and portable media devices.
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGAs offer three main advantages: high density, heat conduction, and low-inductance leads. Palomar Technologies Assembly offers unique assembly methods supporting flux-less Micro BGA solder reflow.
Miniature crystals are used for wireless, patient monitoring, wireless telemetry, and telecommunications applications. They have a low profile and wide frequency range.
Atomic clocks are the most accurate way of measuring time. They’re constructed by locking an electronic oscillator to the frequency of an atomic transition. The most commonly used atomic clocks are the cesium beam atomic clock and the rubidium clock.

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