About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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Automotive assemblies have a broad range of applications. Some common applications that require high precision packaging are sensors and gyroscopes. Microelectronic modules, PCB, MEMS, and MCMs also make up the auto package. All of them are key components that measure machine health; for example, they can help detect misalignment, gear failure, or rotor imbalance.
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Automotive sensor packages include brake wear sensors, steering system sensors, gear position sensors, electronic transmission sensors, and suspension position sensors.
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Specialty refers to rare or uncommon lead frame types. This application requires highly customized and flexible packaging equipment. Palomar Technologies experts can work with a variety of lead frames and incorporate them into fully automated material handling solutions. With advances in microelectronics, specialty lead frames are becoming more common as odd-form packages grow further in sophistication.
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Flexible electronics, also known as flex circuit, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide and PEEK Film. Flex circuits are often used as connectors in various applications, where flexibility, space savings, or production constraints limit the serviceability of rigid circuit boards and hand wiring. Aside from cameras and computer keyboards, another common application of flex circuits is automotive wiring.
High accuracy gyroscopes are key components in navigation systems and roll-over detection for airbag systems. Gyroscopes use MEMS technology, which combines electronic circuitry with mechanical structures to produce different outcomes.
An accelerometer measures proper acceleration and tracks the movement and orientation of an electronic device. It helps detect car crashes and deploys airbags instantaneously.
Solid oxide fuel cells are electrochemical conversion devices that create electricity by oxidizing a fuel. They can power automobiles and make the engine more efficient and emission-free.
System in a package (SiP) technology is designed for multiple advanced packaging applications to create solutions that can be customized depending on the need of the user. It performs all or most of the functions of an electronic system and can be used for servers, wearable computers, and automotive applications.
Laser diode applications consist of monochromatic wavelengths spread with phosphor, which creates a more natural lighting than laser. More car companies are contemplating using laser diode headlights as they require less energy than HB LEDs. Laser diode light fixtures create a more targeted point of light, which may increase visual safety for the drive and limit the offensive glare that comes from halogen lights.

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