About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides packaging solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, Palomar now supports a wide range of industries including automotive, lasers, LEDs, medical & bio photonics, military/high reliability/MEMS, power semiconductors, RF/microwave/wireless, sensors and telecom/5G/Datacom. Select your industry to learn about Palomar’s solutions.

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Overview


Innovation Centers

Palomar® Technologies offers multiple locations with full-service OSAT laboratories which provide volume manufacturing, process development, package prototyping, assembly, test, and measurement for processes such as die attach, wire bonding, vacuum reflow, and more.

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Overview


Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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Overview


Royce Instruments’ bond testing systems can handle a variety of testing applications including wire bond loop pull testing, wire bond ball shear testing, BGA ball shear and pull testing, die bond shear testing, and high speed ball shear testing.

AP+: Automated Die Sorter

AutoPlacer MP300: Automatic Die Handling, Ejector & Sorting System

  • Fully automated pick-and place
  • Designed for automatic die sorting from wafer maps, including multi-project wafers (a.k.a. "pizza wafers")
  • User-friendly DieSort Manager software and expanded wafer map library

 

DE35-ST: Semi-Automatic Die Handling System

  • Supports up to 300mm die wafers
  • 700 to 1200 UPH (application dependent)
  • Output stage for waffle packs, Gel-Paks, film frames, etcetera
Royce AutoPlacer MP300
Royce 650 Universal Pull Tester

650 Universal Bond Tester

  • 305mm x 155mm stage for 300mm wafers, lead frames, or substrates
  • Ultra-fine pitch (UFP) capable
  • Ribbon bond testing for standard to high-power devices
  • Die shear up to 200 kgf
  • Robust test modules with range switching, on board calibration memory, and tool protection

 

620 Multi-test Bond Tester

  • Responsive joystick and manipulator: Z height positioning of the module (and tool rotation for wire pull testing), while the manual manipulator allows operator to control the XY and theta movements of the part
  • Compatibility with legacy systems

610 Dedicated Wire Pull Bond Tester

  • Data output to any PC using RS232
  • Ergonomic design 
  • Simple calibration interface (NIST traceable calibration weights available)
  • Optional strip printer
  • Optional keypad for enhanced failure code input
  • Optional external Royce PC with Bond Test Manager software for data storage and networking
Royce 610 Wire Pull Bond Tester