Radio Frequency or RF packaging transfers signals while preserving bandwidth. RF packaging and assembly provides extremely accurate, high-yield microchip assembly solutions. Packaging needs at higher frequencies are being driven by the applications of personal communication, wireless local area networks, satellite communications, and automotive electronics.
With the launch of 5G networks powering Smart Cities around the world, the demand for RF GaN power amplifiers is exploding and RF GaN production is rapidly moving into commercialization. Silver sintering for power electronics offers the ability to deliver high thermal and electrical conductivities, low process temperature and high reliability while in production, greatly reducing cycle time, thereby reducing costs for the development of all RF GaN device packages. Other applications for RF GaN are seen in microwave and millimeter-wave electronics such as radar, satellite communications, and defense.