About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides packaging solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, Palomar now supports a wide range of industries including automotive, lasers, LEDs, medical & bio photonics, military/high reliability/MEMS, power semiconductors, RF/microwave/wireless, sensors and telecom/5G/Datacom. Select your industry to learn about Palomar’s solutions.

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Overview


Innovation Centers

Palomar® Technologies offers multiple locations with full-service OSAT laboratories which provide volume manufacturing, process development, package prototyping, assembly, test, and measurement for processes such as die attach, wire bonding, vacuum reflow, and more.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.

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Overview


Hybond’s thermosonic ball and wedge wire bonders, single point TAB bonders, epoxy and silver-glass die bonders, eutectic and laser diode die bonders, DFS Universal Bonder Test units offer customers a variety of adjustable height heated work stages.

Model 626 Multipurpose Digital Thermosonic Bonder is a deep-access, long-reach bonder used for ball, wedge, bump, and peg bonding. It bonds both gold, aluminum wire, and ribbon, as well as copper, silver, palladium-silver and up to 1.5 mil platinum wire (application dependent).

Model 676 Digital Thermosonic Wedge Bonder is a deep-access, long-reach thermosonic wedge bonder used with gold wire and gold or aluminum ribbon. In some applications, it can be used to bond copper, silver, palladium-silver, and up to 1.5 mil platinum wire.

Model 522A Ball Bonder is a manual thermosonic ball bonder using 0.7 to 2.0 mil gold wire. 

Model 522A-40 Deep-Access Ball Bonder is a deep-access long-reach thermosonic ball bonder that uses 0.7 to 2.0 mil gold wire. 

Model 572A Wedge Bonder is a manual thermosonic wedge bonder thay uses gold wire and gold or aluminum ribbon.

Model 572A-40 Deep-Access Wedge Bonder is a deep-access long-reach thermosonic wedge bonder used with gold wire and gold or aluminum ribbon.

Hybond 626 MP Wire Bonder
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Model EDB-141 Epoxy/Silver Glass Die Bonder is a semi-automatic epoxy/silver glass die bonder featuring selectable and uniform dispense patterns with bond line accuracy of 12.7 microns. It can handle die sizes up to 25mm standard, and can store 200 dispense programs.

Model EDB-140B Epoxy Die Bonder is a semi-automatic dispense of epoxy, conductive epoxy, or silver glass with a bond line accuracy of 12.7 microns. It can handle die sizes up to 25mm standard, and can store 200 dispense programs.

Model UDB-141 Eutectic Die Bonder is a semi-automatic eutectic bonder with standard placement accuracy of 12.5-25 microns (application dependent). It features single footswitch operation for pick-and-place. A turret head allows the machine to pick up preforms and die with separate collets.

Model UDB-206A Eutectic Die Bonder has precise control of ultrasonic scrub energy, force, and time (scrub duration) to provide consistent wetting without damaging die. It’s ideal for low-to-medium volume and high-reliability production.

HY-Pulse 900A Fluxless /Eutectic Solder Station is a standalone unit for fluxless soldering applications, and can be used in conjunction with the UDB-140B.