Wedge Bonding


Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding

Wedge bonding works by using a wedge bonder. A wire is passed through the wedge tool over the microchip. The capillary then settles over the area that needs to be wired up - usually called the die or substrate. The tool descends to the surface so that the wire is pressed between the substrate and the tip of the capillary (the surface is usually gold, but could also be palladium or silver). Ultrasonic energy is applied and the result is a wedge bond.

To learn more about wedge bonding, download the eBook here.

Product Solutions from Palomar Technologies

Palomar Technologies has developed the 9000 Wedge Bondera high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90° deep access on a single large work area. 

9000_transparent.png 9000 Wedge Bonder data sheet

A Brief History of Wedge Bonding

The first wedge bonder was a thermocompression wedge bonder designed in 1957. It wasn’t until the 1960s that ultrasonic wedge bonding was introduced. Beginning in the 1970s, thermosonic wedge bonding was being performed. By the time the 1980s rolled around, automated wedge bonders and automated wire bonders were being produced and sold all over the world. Among the top designers and manufacturers for wedge and wire bond technology was Hughes Aircraft

Palomar Technologies, formerly Hughes Aircraft, has continued this legacy of wedge and wire bonder technology, remaining deeply rooted and established in power, precision, performance and success.