The 3800 Die Bonder comes with a process camera for live viewing of pick-and-place processes. The sophisticated 8-position tool turret enables rapid tool changes on the fly.

35.5" x 20" work area with Linear Motors, Pulse Heat and Steady State Stages for Eutectic Die Attach and 2 and 3 channels of adhesive dispensing.

Designed for customized inline assembly, the 3800 Die Bonder has removable side panels with a front facing user interface.

The fully automated 3800 Die Bonder offers its user the latest in design, mechanics, software and ergonomics. 

Suited for complex applications such as:

• HB/HP LED Assembly
• Microwave Modules
• RF Power Amps
• Complex Hybrids
• MEMS
• Laser Diodes
• LED Printhead Attachment

With multiple options including pulse heat and steady state stages for eutectic die attach applications, the 3800 Die Bonder meets the needs of the most unique and complex applications.