Automated Flip Chip Assembly
Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and ...
Posted by Janine Powell on
Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and ...
Posted by Janine Powell on
[For the English version, click here.] ...
Posted by Janine Powell on
Factory automation is a cost-effective and resource-efficient solution for many complex microelectronic assembly challenges. Factory ...
Posted by Palomar Technologies MarCom Team on
Cost and availability of spare parts are of considerate interest to anyone who currently owns a piece of capital equipment or anyone ...
Posted by Palomar Technologies MarCom Team on
The decision process to purchase a high-end, “big ticket item” piece of microelectronics manufacturing equipment is not always a simple ...
Posted by Palomar Technologies MarCom Team on
With the growing installed base of 3800 Die Bonder customers and the long-standing presence of the 8000 Wire Bonder across the APAC region, ...
Posted by Palomar Technologies MarCom Team on
Palomar Technologies recently met with Stephen Duffy, director of sales and marketing at Optocap (based in Livingston, Scotland), to learn ...
Posted by Palomar Technologies MarCom Team on
Today, the demands for smaller packages require highly reliable thermal coupling to associated packages. Therefore, bondline thickness must ...
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The rapid increase in the LED market (for notebook backlights, LED TVs and automobile headlights) is spurring heavy capital investments by ...
Posted by Palomar Technologies MarCom Team on
最有效的生产到上市模式 - Palomar 的封装服务部门是美国极少数有能力提供全方位封装服务的实验室。该实验室设在Palomar南加州Carlsbad的总部。实验室内采用了公司本身最精密,最先进的贴片机和球焊机。其他设備还包括了 GPD 的点胶机和 Royce ...
Posted by Palomar Technologies MarCom Team on
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