Challenge Us with Your Microelectronics Packaging Needs in 2013
It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...
Posted by Palomar Technologies MarCom Team on
It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...
Posted by Palomar Technologies MarCom Team on
As microelectronics device designs evolve, so must handling and assembly processes. A common example is with the process of removing ...
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With the growing installed base of 3800 Die Bonder customers and the long-standing presence of the 8000 Wire Bonder across the APAC region, ...
Posted by Palomar Technologies MarCom Team on
The search for a "complete, yet customized, solution to a microelectronics assembly requirement" is an all-too-common request from a ...
Posted by Palomar Technologies MarCom Team on
我们经常听到客户问一个同样的问题,就是关于图像识别照明灯光的颜色。到底是越多种颜色越好呢,或是红蓝绿混合的白光,或是单色好呢? 为了使大家进一步了解图像识别照明灯光颜色的效果,我们很乐意跟大家分享PalomarTechnologies在30多年里所累积的经验和实践。 ...
Posted by Palomar Technologies MarCom Team on
Today, the demands for smaller packages require highly reliable thermal coupling to associated packages. Therefore, bondline thickness must ...
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I would like to take a moment and thank you for your subscription to the PTI Blog. I hope you have found each weekly post both insightful ...
Posted by Palomar Technologies MarCom Team on
Once wire bonding or die bonding is complete, the next step in the microelectronics assembly process is to test the quality of the ...
Posted by Palomar Technologies MarCom Team on
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