About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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RESEARCH INITIATIVE – FRAUNHOFER IISB

Advancements in Power Electronics & Automotive Microelectronics Packaging

Palomar Technologies works with research institutes around the world to contribute to the development and advancement of techniques and technologies key to microelectronics packaging for the semiconductor industry. Our work with these institutes results in new processes, new products, or new applications for our customers.

Palomar Technologies subsidiary, SST Vacuum Reflow Systems is working closely with the Fraunhofer Institute for Integrated Systems and Device Technology IISB in the area of high-quality, void-free power module packaging for electric vehicles.

The Fraunhofer Institute for Integrated Systems and Device Technology IISB conducts applied research and development in the field of electronic systems for application in, e.g., electric mobility, aerospace, Industry 4.0, power grids or energy technology. In this connection, the institute uniquely covers the entire value chain – from basic materials to whole power electronic systems.

 

Fraunhofer IISB
SST_8301

As part of the cooperation, Palomar has placed an SST 8301 Automated Vacuum Soldering System within the Fraunhofer Institute. It will be available for demonstrations, prototypes, and research projects focusing on key components inside power electronics, dies to DBC, connectors/pins to DBC and DBC to base plate soldering. The SST 8300 Series Automated Vacuum Pressure System offers superior bond technology for soldering and/or sintering processes. The entire process takes place in a single chamber with a single profile, however, additional chambers can be added or upgraded in the field as production capacity needs increase.

The SST 8301 is the only solution to use both vacuum pressure and pressure above atmospheric, serving to drive voids close to zero. This technology solves the key problem of voiding and thermal mismatches with the larger surface area attachments in the critical DBC to Baseplate joint. The 8301 is capable of a reliable flux-less soldering with less than 1% voiding, significantly improving yielded throughput.

To learn more about the capabilities of the SST 8300 Series, click here.

To learn more about how you can work with SST and Fraunhofer IISB utilizing the SST 8301, please contact:

Thorsten Scheidler, Sales Director Europe - SST Vacuum Reflow Systems
Palomar Technologies GmbH
Am Weichselgarten 30b │ 91058 Erlangen, Germany
Mobile: +49 151 18156815
E-mail: TScheidler@sstinternational.com

 

 

 

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Data Sheet White@2x.png 3880 Die Bonder
Data Sheet White@2x.png Technical Papers & eBooks
Data Sheet White@2x.png 8100 Wire Bonder
Data Sheet White@2x.png Process Development Services