Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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The Future is Near EV

Advancements in Power Electronics & Automotive Microelectronics Packaging

Palomar Technologies works with research institutes around the world to contribute to the development and advancement of techniques and technologies key to microelectronics packaging for the semiconductor industry. Our work with these institutes results in new processes, new products, or new applications for our customers.

Palomar Technologies subsidiary, SST Vacuum Reflow Systems is working closely with the Fraunhofer Institute for Integrated Systems and Device Technology IISB in the area of high-quality, void-free power module packaging for electric vehicles.

The Fraunhofer Institute for Integrated Systems and Device Technology IISB conducts applied research and development in the field of electronic systems for application in, e.g., electric mobility, aerospace, Industry 4.0, power grids or energy technology. In this connection, the institute uniquely covers the entire value chain – from basic materials to whole power electronic systems.

As part of the cooperation, Palomar has placed an SST 8301 Automated Vacuum Soldering System within the Fraunhofer Institute. It will be available for demonstrations, prototypes, and research projects focusing on key components inside power electronics, dies to DBC, connectors/pins to DBC and DBC to base plate soldering. The SST 8300 Series Automated Vacuum Pressure System offers superior bond technology for soldering and/or sintering processes. The entire process takes place in a single chamber with a single profile, however, additional chambers can be added or upgraded in the field as production capacity needs increase.

The SST 8301 is the only solution to use both vacuum pressure and pressure above atmospheric, serving to drive voids close to zero. This technology solves the key problem of voiding and thermal mismatches with the larger surface area attachments in the critical DBC to Baseplate joint. The 8301 is capable of a reliable flux-less soldering with less than 1% voiding, significantly improving yielded throughput.


Learn more about how YOU can work with SST and Fraunhofer IISB utilizing the SST 8301


About Thorsten Scheidler

Sales Director Europe - SST Vacuum Reflow Systems
Palomar Technologies GmbH
Am Weichselgarten 30b │ 91058 Erlangen, Germany
Mobile: +49 151 18156815



The Automated Vacuum Soldering System that is changing the future of EV's 
  • IGBT Modules
  • Power Module Assembly
  • GaAs/GaN/SiC Die Attach
  • Die Attach for Pressure Sensors
  • High Intensity LED Attach
Image at right is courtesy of Anja Grabinger.