About

Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

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Applications

Palomar® Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

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Overview


Innovation Centers

Palomar® Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

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Resources

Get access to our entire knowledge database: read blog articles and download materials.

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Contact Us

Contact Palomar® Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

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UPCOMING EVENTS

Photonics+ Virtual Exhibition and Conference

Martyn Davies, New Business Development from Palomar Technologies UK will present: "Die Bond Flexibility for Next Generation Photonic Packaging." Start the year with a bang and meet Palomar Technologies at Photonics+ Virtual Conference and...
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Feb 17 - Feb 18, 2021

WEBINAR: The journey to full-scale semiconductor packaging: Part 1: Manufacturability Challenges of Semiconductor Packages for Start-ups

February 17, 2021 11 am PST The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles along the way including everything from diverse teams scattered across the world to simply not...
Event Image - WEBINAR: The journey to full-scale semiconductor packaging: Part 1: Manufacturability Challenges of Semiconductor Packages for Start-ups
Feb 17 - Feb 17, 2021

WEBINAR: Power Modules: Typical failure modes and how to solve them

March 3 8 am PST Power Modules is a rapidly growing segment with high-growth applications ranging from electric vehicles, high-speed rail, and large medical devices. However, the stack of interconnects in power modules are the source of mechanical...
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Mar 3 - Mar 3, 2021

SPIE Photonics West

Virtual Join Palomar Technologies online at SPIE Photonics West to see our latest solutions for photonics/optoelectronic packaging.
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Mar 6 - Mar 11, 2021

SEMICON West

San Francisco, CA July 13-15, 2021 Join Palomar Techonologies at the Moscone Center in San Francisco to see our latest solutions for photonics/optoelectronic packaging.
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Jul 13 - Jul 15, 2021

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