The journey to full-scale semiconductor packaging: Part 2: Process Optimization Challenges of Semiconductor Manufacturing
The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles along the way including everything from diverse teams scattered across the world to simply not understanding how the manufacturing process of die bonding, wire bonding or vacuum reflow impacts the package design and vise versa. In this 3-part series, we will present the challenges faced from package design and prototyping, through process development and process optimization to ensure the device can indeed be manufactured with the desired throughput and quality.
In Part 2, we'll present process optimization challenges often faced throughout the manufacturing cycle moving from prototype to production and how to solve them.
