Wednesday, August 23, 2023 | 8AM - 9AM PST
The number of particles within a hermetically sealed device often have large effects on not only the product’s performance but also its longevity. From impacting the potential image clarity of various IR sensors to possibly increasing the lifespan of MEMs devices destined for space by an extra few years; sealed-in-gas pressure is an important metric to not only measure but also prioritize during assembly. The final pressure within a hermetically sealed package is affected by numerous factors such as hermetic seal quality, environmental pressure at time of sealing, and sources of particles within the sealed volume. To combat any potential outgassing or particle generation, getters (adsorbent materials) are usually used within the device.
Understanding the tools available to optimally reduce sealed-in-gas pressure for hermetic seal applications is critical to maximizing the effectiveness of your end product. This webinar will aim to delve into the many techniques available for minimizing long term particle presence in hermetic packages. Using Palomar’s SST 3150 as an example tool for hermetic seal applications, the following elements will be explored in detail:
• Seal strength and the factors that contribute to it, such as:
- Surface metallization layer thicknesses and purity
- Solder material and form choice
- Surface and solder preparation and treatment
• Environmental vacuum level and methods to reach pressures as low as possible, including:
- Thermal routines combined with multiple “pump-downs”
- Auxiliary mechanisms to draw moisture and particles out of the chamber
- Specific, intentional chamber design choices to prevent “particle sticking”
• Getters and considerations for how they can be optimally activated during hermetic sealing:
- Protecting the integrity of solders while thermally activating getters
- Creating separate thermal zones in a single high vacuum environment
- Solder choices to match getter selections
