September 13 - 15 in Bordeaux, France
Come join us in Booth 317 and learn about Palomar's solutions for the photonics industry.
Palomar provides a range of flexible packaging solutions for photonics applications. The Palomar 3880 Die Bonder offers the perfect balance of accuracy, throughput and flexibility. Using the 3880, 5μm TEC and CoC tack bonding, packages are fed into the SST 8300 Automated Vacuum Pressure Soldering System for void free, high-reliability, high-thermal stability applications. The Palomar 8100 Wire/Ball Bonder feeds the 3880 with accurate planar Au ball bumps in preparation for successful PiC flip chip thermos compressions applications.